Datasheet > 1PGSMB5933

1PGSMB5933

更新时间： 2024-11-07 00:39:55

品牌	Logo	应用领域
TSC		/
页数	文件大小	规格书
6页	300K
描述
3W, 11V - 200V Surface Mount Silicon Zener Diode

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中文翻译

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数据手册

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1PGSMB5933 数据手册

1PGSMB5926 - 1PGSMB5956

Taiwan Semiconductor

3W, 11V - 200V Surface Mount Silicon Zener Diode

FEATURES

KEY PARAMETERS

● Photo Glass passivated junction

● Low profile package

PARAMETER

VALUE

11 - 200

1.9 – 34.1

3.0

UNIT

V_Z

Test current I_ZT

P_tot

● Ideal for automated placement

● Built-in strain relief

● Low inductance

● Compliant to RoHS Directive 2011/65/EU and

in accordance to WEEE 2002/96/EC

● Halogen-free according to IEC 61249-2-21

T_{J MAX}

175

°C

Package

Configuration

DO-214AA (SMB)

Single die

APPLICATIONS

● Switching mode power supply (SMPS)

● Adapters

● Lighting application

● On-board DC/DC converter

MECHANICAL DATA

● Case: DO-214AA (SMB)

● Molding compound meets UL 94 V-0 flammability rating

● Part no. with suffix "H" means AEC-Q101 qualified

● Packing code with suffix "G" means green compound

(halogen-free)

● Terminal: Matte tin plated leads, solderable per J-STD-002

● Moisture sensitivity level: level 1, per J-STD-020

● Meet JESD 201 class 2 whisker test

DO-214AA (SMB)

● Polarity: As marked

● Weight: 0.1 g (approximately)

ABSOLUTE MAXIMUM RATINGS (T_A= 25°C unless otherwise noted)

PARAMETER

SYMBOL

VALUE

UNIT

DC power dissipation at T_L=75°C, measure at

zero lead length (Note 1) derate above 75°C

P_tot

3.0

Watts

T_J

-55 to +175

°C

Junction temperature

T_STG

Storage temperature

Note:

1. Mounted on Cu-Pad size 10mm x 10mm on PCB

THERMAL PERFORMANCE

PARAMETER

Junction-to-lead thermal resistance

Junction-to-ambient thermal resistance

Junction-to-case thermal resistance

SYMBOL

R_ӨJL

LIMIT

UNIT

°C/W

R_ӨJA

R_ӨJC

Thermal Performance Note: Units mounted on recommended PCB (10mm x 10mm Cu pad test board)

Version:A1705

12 3 4 5 6

中文翻译

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