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1PGSMB5941 PDF预览

1PGSMB5941

更新时间: 2024-11-07 00:39:55
品牌 Logo 应用领域
TSC /
页数 文件大小 规格书
6页 300K
描述
3W, 11V - 200V Surface Mount Silicon Zener Diode

1PGSMB5941 数据手册

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1PGSMB5926 - 1PGSMB5956  
Taiwan Semiconductor  
3W, 11V - 200V Surface Mount Silicon Zener Diode  
FEATURES  
KEY PARAMETERS  
Photo Glass passivated junction  
Low profile package  
PARAMETER  
VALUE  
11 - 200  
1.9 34.1  
3.0  
UNIT  
VZ  
Test current IZT  
Ptot  
V
mA  
W
Ideal for automated placement  
Built-in strain relief  
Low inductance  
Compliant to RoHS Directive 2011/65/EU and  
in accordance to WEEE 2002/96/EC  
Halogen-free according to IEC 61249-2-21  
TJ MAX  
175  
°C  
Package  
Configuration  
DO-214AA (SMB)  
Single die  
APPLICATIONS  
Switching mode power supply (SMPS)  
Adapters  
Lighting application  
On-board DC/DC converter  
MECHANICAL DATA  
Case: DO-214AA (SMB)  
Molding compound meets UL 94 V-0 flammability rating  
Part no. with suffix "H" means AEC-Q101 qualified  
Packing code with suffix "G" means green compound  
(halogen-free)  
Terminal: Matte tin plated leads, solderable per J-STD-002  
Moisture sensitivity level: level 1, per J-STD-020  
Meet JESD 201 class 2 whisker test  
DO-214AA (SMB)  
Polarity: As marked  
Weight: 0.1 g (approximately)  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)  
PARAMETER  
SYMBOL  
VALUE  
UNIT  
DC power dissipation at TL=75°C, measure at  
zero lead length (Note 1) derate above 75°C  
Ptot  
3.0  
Watts  
TJ  
-55 to +175  
-55 to +175  
°C  
°C  
Junction temperature  
TSTG  
Storage temperature  
Note:  
1. Mounted on Cu-Pad size 10mm x 10mm on PCB  
THERMAL PERFORMANCE  
PARAMETER  
Junction-to-lead thermal resistance  
Junction-to-ambient thermal resistance  
Junction-to-case thermal resistance  
SYMBOL  
RӨJL  
LIMIT  
21  
UNIT  
°C/W  
°C/W  
°C/W  
RӨJA  
59  
RӨJC  
23  
Thermal Performance Note: Units mounted on recommended PCB (10mm x 10mm Cu pad test board)  
1
Version:A1705  

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