1PGSMB5926 - 1PGSMB5956
Taiwan Semiconductor
3W, 11V - 200V Surface Mount Silicon Zener Diode
FEATURES
KEY PARAMETERS
● Photo Glass passivated junction
● Low profile package
PARAMETER
VALUE
11 - 200
1.9 – 34.1
3.0
UNIT
VZ
Test current IZT
Ptot
V
mA
W
● Ideal for automated placement
● Built-in strain relief
● Low inductance
● Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
● Halogen-free according to IEC 61249-2-21
TJ MAX
175
°C
Package
Configuration
DO-214AA (SMB)
Single die
APPLICATIONS
● Switching mode power supply (SMPS)
● Adapters
● Lighting application
● On-board DC/DC converter
MECHANICAL DATA
● Case: DO-214AA (SMB)
● Molding compound meets UL 94 V-0 flammability rating
● Part no. with suffix "H" means AEC-Q101 qualified
● Packing code with suffix "G" means green compound
(halogen-free)
● Terminal: Matte tin plated leads, solderable per J-STD-002
● Moisture sensitivity level: level 1, per J-STD-020
● Meet JESD 201 class 2 whisker test
DO-214AA (SMB)
● Polarity: As marked
● Weight: 0.1 g (approximately)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
SYMBOL
VALUE
UNIT
DC power dissipation at TL=75°C, measure at
zero lead length (Note 1) derate above 75°C
Ptot
3.0
Watts
TJ
-55 to +175
-55 to +175
°C
°C
Junction temperature
TSTG
Storage temperature
Note:
1. Mounted on Cu-Pad size 10mm x 10mm on PCB
THERMAL PERFORMANCE
PARAMETER
Junction-to-lead thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
SYMBOL
RӨJL
LIMIT
21
UNIT
°C/W
°C/W
°C/W
RӨJA
59
RӨJC
23
Thermal Performance Note: Units mounted on recommended PCB (10mm x 10mm Cu pad test board)
1
Version:A1705