IN5518BUR-1 thru 1N5546BUR-1
(or MLL5518B-1 thru MLL5546B-1)
Low Voltage Surface Mount
500 mW Avalanche Diodes
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
The 1N5518BUR-1 thru 1N5546BUR-1 series of 0.5 watt glass surface
mount Zener voltage regulators provides a selection from 3.3 to 33 volts in
standard 5% tolerances as well as tighter tolerances identified by different
suffix letters on the part number. These have an internal-metallurgical-bond
option as identified by the “–1” suffix. This internally bonded Zener package
construction is also in JAN, JANTX, and JANTXV military qualifications.
Microsemi also offers numerous other Zener products to meet higher and
lower power applications.
DO-213AA
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
•
Surface mount equivalent to JEDEC registered
1N5518 thru 1N5546 series
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Regulates voltage over a broad operating current
and temperature range
•
•
Internal metallurgical bond with the “-1” suffix
•
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Extensive selection from 3.3 to 33 V
Also available in JAN, JANTX, and JANTXV
qualifications per MIL-PRF-19500/437 by adding
the JAN, JANTX, or JANTXV prefixes to part
numbers for desired level of screening; (e.g.
JANTX1N4099UR-1, JANTXV1N4109CUR-1, etc.)
Standard voltage tolerances are plus/minus 5% with
a “B” suffix, e.g. 1N5518BUR-1, etc.
•
Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively, e.g. 1N5518CUR-1,
1N5518DUR-1, etc.
•
•
Nonbonded types also available without the “-1”
suffix for both the axial and surface mount
packages
•
•
•
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Hermetically sealed surface mount package
Nonsensitive to ESD per MIL-STD-750 Method 1020
Minimal capacitance (see Figure 3)
DO-7 or DO-35 glass body axial-leaded Zener
equivalents also available per JEDEC registration
with part numbers 1N5518 thru 1N5546 on
separate data sheets
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
•
•
Operating and Storage temperature: -65ºC to
•
•
•
CASE: Hermetically sealed glass DO-213AA
(SOD80 or MLL34) MELF style package
+175ºC
Thermal Resistance: 100 ºC/W junction to end cap,
or 250ºC/W junction to ambient when mounted on
FR4 PC board (1 oz Cu) with recommended
footprint (see last page)
TERMINALS: End caps tin-lead plated solderable
per MIL-STD-750, method 2026
POLARITY: Cathode indicated by band where
diode is to be operated with the banded end positive
with respect to the opposite end for Zener regulation
•
Steady-State Power: 0.5 watts at end cap
temperature TEC < 125oC or at ambient TA < 50ºC
when mounted on FR4 PC board as described for
thermal resistance above (see Figure 2 for
derating)
•
•
MARKING: cathode band only
TAPE & REEL option: Standard per EIA-481-1-A
with 12 mm tape, 2000 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
•
•
Forward voltage @200 mA: 1.1 volts
Solder Temperatures: 260 ºC for 10 s (max)
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WEIGHT: 0.04 grams
See package dimensions on last page
Copyright © 2003
10-31-2003 REV B
Microsemi
Page 1
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503