PRODUCT INFORMATION
1A439
1320nm
Datacom
High-Performance LED
This device is designed for FDDI and
ATM 155 Mbps applications and
offers an excellent price/performance
ratio for cost-effective solutions. Its
double-lens optical system results in
optimum coupling of power into the
fiber.
Optical and Electrical Characteristics (Case Temperature -25 to +70° C)
PARAMETER
SYMBOL MIN. TYP. MAX. UNIT
TEST CONDITION
Fiber:
62.5/125m
Graded
Fiber-Coupled Power
P
-18.5
dBm IPeak=60mA
fiber
(Fig.1,2,&3) (Table1)
(Note 1)
Rise and Fall Time
t ,t
2.5
ns
IF=60mA
r f
(10-90%, no bias)
(Note 2)
Index
Bandwidth
f
125
MHz IF=60mA
c
NA=0.275
(3dB
)
el
Center Wavelength
1320
135
nm
nm
IF=60mA (Note 2)
IF=60mA (Note 2)
c
Spectral Width (FWHM)
⌬
Forward Voltage (Fig.5)
Reverse Current
Capacitance
VF
IR
C
1.3 1.65
V
IF=60mA
100 A
VR=1V
200
pF
VR= 0V, f=1MHz
Note 1: Average power at 10 MHz//50% duty cycle. Measured at the exit of 100 meters of fiber.
Note 2: Meets the FDDI ANSI X3T9.5 specification.
Absolute Maximum Ratings
PARAMETER
SYMBOL
LIMIT
Ø4.7
Ø1.5
Storage Temperature
T
-55 to +125ЊC
0.6
stg
3.7
Operating Temperature (derating: Fig.4)
Electrical Power Dissipation (derating: Fig.4)
Continuous Forward Current (fр10 kHz)
Peak Forward Current (duty cycleр50%, fу1 MHz)
Reverse Voltage
T
-55 to +125ЊC
160 mW
80 mA
op
P
tot
14
IF
IFRM
VR
0.4
130 mA
0.5V
CASE
ANODE
CATHODE
Soldering Temperature (2mm from thecase for10sec)
T
260ЊC
sld
2.5
5.4
BOTTOM VIEW
Thermal Characteristics
PARAMETER
The diode chip is isolated from the case.
SYMBOL MIN.
TYP.
MAX.
UNIT
TO-46 Package With Lens
Thermal Resistance -Infinite Heat Sink
R
R
150
400
ЊC/W
thjc
thja
Thermal Resistance - No Heat Sink
ЊC/W
%/ЊC
Temperature Coefficient -Optical Power dP/dT
-0.75
0.45
j
Temperature Coefficient -Wavelength
d/dT
nm/ЊC
j
13429.11 1997-06-26
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