PRODUCT INFORMATION
1A239
840nm
Datacom, General Purpose
High-Performance LED
This device is designed for Ethernet
and general applications and offers an
excellent price/performance ratio for
cost-effective solutions. Since it oper-
ates at low drive current, it generates
minimal heat — reducing cooling
requirements in systems employing
large numbers of LEDs.
Optical and Electrical Characteristics (25° C Case Temperature)
PARAMETER
SYMBOL MIN. TYP. MAX. UNIT
TEST CONDITION
Fiber:
Fiber-Coupled Power
P
50
90
7
W
ns
IF=50 mA
fiber
(Fig.1,2,&3) (Table1)
(Note 1,2)
50/125m
Graded
Rise and Fall Time
t ,t
10
IF=50 mA
r f
(10-90%)
(no bias)
Index
Bandwidth
f
50
MHz
IF=50 mA
c
NA=0.20
(3dB
)
el
Peak Wavelength
820 840 860
50
nm
nm
IF=50 mA
IF=50 mA
p
Spectral Width (FWHM)
⌬
Forward Voltage (Fig.5)
Reverse Current
Capacitance
VF
IR
C
1.8 2.0
20
V
IF=50 mA
VR=1V
A
pF
250
VR= 0V, f=1 MHz
Note 1: Measured at the exit of 100 meters of fiber.
Note 2: 1A239A version with Fiber-Coupled Power > 80
W available on request.
Absolute Maximum Ratings
PARAMETER
SYMBOL
LIMIT
Ø4.7
Ø1.5
Storage Temperature
T
-55 to +125ЊC
-55 to +125ЊC
130 mW
60 mA
0.6
stg
3.7
Operating Temperature (derating: Fig.4)
Electrical Power Dissipation (derating: Fig.4)
Continuous Forward Current (fр10 kHz)
Peak Forward Current (duty cycleр50%, fу1 MHz)
Reverse Voltage
Top
P
tot
14
IF
IFRM
VR
0.4
100 mA
CASE
1.5 V
ANODE
CATHODE
Soldering Temperature (2mm from the case for 10 sec)
T
260ЊC
sld
2.5
5.4
BOTTOM VIEW
Thermal Characteristics
PARAMETER
The diode chip is isolated from the case.
SYMBOL MIN.
TYP.
MAX.
UNIT
TO-46 Package With Lens
Thermal Resistance -Infinite Heat Sink
R
300
600
ЊC/W
thjc
Thermal Resistance -No Heat Sink
R
ЊC/W
%/ЊC
thja
Temperature Coefficient -Optical Power dP/dT
-0.4
0.3
j
Temperature Coefficient -Wavelength
d/dT
nm/ЊC
j
11960.11 & .12 1996-01-23
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