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0780610051

更新时间： 2024-11-09 06:22:27
品牌 Logo 应用领域
莫仕 - MOLEX /
页数 文件大小 规格书
7页 365K
描述
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38μm (15μ) Gold(Au) Selective Plating, 240 Circuits

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0780610051 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：End Of Life包装说明：ROHS COMPLIANT
Reach Compliance Code：unknown风险等级：5.84
其他特性：POLARIZED主体/外壳类型：SOCKET
连接器类型：CARD EDGE CONNECTOR联系完成配合：GOLD
联系完成终止：TIN触点性别：FEMALE
触点材料：PHOSPHOR BRONZEDIN 符合性：NO
滤波功能：NOIEC 符合性：NO
JESD-609代码：e3MIL 符合性：NO
混合触点：NO安装方式：STRAIGHT
安装类型：BOARD装载的行数：2
选件：GENERAL PURPOSE端子节距：1 mm
端接类型：SOLDER触点总数：240
UL 易燃性代码：94V-0

0780610051 数据手册

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This document was generated on 04/13/2010  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  
Part Number:  
Status:  
0780610051  
Active  
Description:  
1.00mm (.039") Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38µm  
(15µ") Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins, with Black  
Latches, 2.67mm (.105") Solder Tail Length, Lead-free  
Documents:  
3D Model  
Drawing (PDF)  
Product Specification PS-78061-001 (PDF)  
RoHS Certificate of Compliance (PDF)  
Series  
image - Reference only  
China RoHS  
Agency Certification  
CSA  
UL  
LR 19980  
E29179  
EU RoHS  
ELV and RoHS  
Compliant  
REACH SVHC  
Contains SVHC: No  
Halogen-Free  
Status  
Not Halogen-Free  
Need more information on product  
environmental compliance?  
General  
Product Family  
Series  
Memory Module Sockets  
78061  
<LI>Latches in Black Color <LI>Solder Tail Length at  
2.67mm (.105")  
Socket  
Comments  
Component Type  
JEDEC Outline  
Product Name  
MO-256  
FB DIMM  
Email productcompliance@molex.com  
For a multiple part number RoHS Certificate of  
Compliance, click here  
Physical  
Circuits (Loaded)  
240  
Black  
Color - Resin  
Durability (mating cycles max)  
Entry Angle  
Flammability  
25  
Please visit the Contact Us section for any  
non-product compliance questions.  
Vertical (Top Entry)  
94V-0  
Keying to Mating Part  
Material - Metal  
Yes  
Brass, Phosphor Bronze  
Material - Plating Mating  
Material - Plating Termination  
Material - Resin  
Gold  
Tin  
Search Parts in this Series  
78061Series  
High Temperature Thermoplastic  
PC Tail Length (in)  
PC Tail Length (mm)  
PCB Locator  
0.105 In  
2.67 mm  
Yes  
Mates With  
JEDEC MO-256 modules  
PCB Retention  
Yes  
PCB Thickness Recommended (in)  
PCB Thickness Recommended (mm)  
Packaging Type  
0.062 In  
1.60 mm  
Tray  
Pitch - Mating Interface (in)  
Pitch - Mating Interface (mm)  
Temperature Range - Operating  
Termination Interface: Style  
0.039 In  
1.00 mm  
-55°C to +85°C  
Through Hole  
Electrical  
Current - Maximum per Contact  
Voltage - Maximum  
Voltage Key  
1A  
30V  
1.8V, Center  
Solder Process Data  
Duration at Max. Process Temperature (seconds)  
Lead-free Process Capability  
5
SMC & Wave Capable (TH only)  
Max. Cycles at Max. Process Temperature  
Process Temperature max. C  
1
265  
1234567

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