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0780790022 PDF预览

0780790022

更新时间: 2024-01-09 14:37:52
品牌 Logo 应用领域
莫仕 - MOLEX 连接器
页数 文件大小 规格书
2页 32K
描述
Card Edge Connector

0780790022 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ObsoleteReach Compliance Code:unknown
风险等级:5.83连接器类型:CARD EDGE CONNECTOR
联系完成配合:NOT SPECIFIED触点材料:NOT SPECIFIED
Base Number Matches:1

0780790022 数据手册

 浏览型号0780790022的Datasheet PDF文件第2页 
This document was generated on 11/11/2013  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  
Part Number:  
Status:  
78079-0022  
Active  
DDR3 DIMM  
Overview:  
Description:  
1.00mm Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins,  
Black Housing and Latches, 0.076µm Gold (Au) Plating, 3.18mm Soldertail, 240  
Circuits, Lead-Free  
Documents:  
3D Model  
Drawing (PDF)  
Product Specification PS-78079-003 (PDF)  
RoHS Certificate of Compliance (PDF)  
Series  
image - Reference only  
China RoHS  
ELV and RoHS  
Compliant  
Agency Certification  
CSA  
UL  
EU RoHS  
LR19980  
E29179  
General  
Product Family  
Series  
Component Type  
Electrical Model  
JEDEC Outline  
Overview  
Product Name  
UPC  
REACH SVHC  
Contains SVHC: No  
Low-Halogen Status  
Not Low-Halogen  
Memory Module Sockets  
78079  
Socket  
Yes  
MO-269  
DDR3 DIMM  
DDR3 DIMM  
800756837789  
Need more information on product  
environmental compliance?  
Email productcompliance@molex.com  
For a multiple part number RoHS Certificate of  
Compliance, click here  
Physical  
Circuits (Loaded)  
Circuits (maximum)  
Color - Resin  
Please visit the Contact Us section for any  
non-product compliance questions.  
240  
240  
Black  
Durability (mating cycles max)  
Entry Angle  
25  
Vertical  
Flammability  
Function Key  
94V-0  
None  
Yes  
Copper Alloy  
Gold  
Tin  
Search Parts in this Series  
78079Series  
Keying to Mating Part  
Material - Metal  
Material - Plating Mating  
Material - Plating Termination  
Material - Resin  
Mates With  
JEDEC Standard 1.27mm Modules  
High Temperature Thermoplastic  
Net Weight  
PC Tail Length  
PCB Locator  
9.283/g  
3.18mm  
Yes  
PCB Retention  
Yes  
PCB Thickness - Recommended  
Packaging Type  
2.36mm  
Tray  
Pitch - Mating Interface  
Pitch - Termination Interface  
Plating min - Mating  
Plating min - Termination  
Temperature Range - Operating  
Termination Interface: Style  
1.00mm  
1.00mm  
0.076µm  
2.540µm  
-55°C to +85°C  
Through Hole  
Electrical  
Current - Maximum per Contact  
Voltage - Maximum  
Voltage Key  
1A  
30V AC (RMS)/DC  
Center  
Solder Process Data  

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