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0780790101

更新时间： 2024-11-07 06:19:15
品牌 Logo 应用领域
莫仕 - MOLEX 锁存器双倍数据速率
页数 文件大小 规格书
18页 1592K
描述
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Off-White Housing and Latches, 0.38μm (15μ) Gold (Au) Plating

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0780790101 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete包装说明：ROHS COMPLIANT
Reach Compliance Code：compliant风险等级：5.83
其他特性：LATCHED, POLARIZED主体/外壳类型：SOCKET
连接器类型：CARD EDGE CONNECTOR联系完成配合：GOLD (15)
联系完成终止：TIN (100)触点性别：FEMALE
触点材料：COPPER ALLOYDIN 符合性：NO
滤波功能：NOIEC 符合性：NO
JESD-609代码：e3MIL 符合性：NO
混合触点：NO安装方式：STRAIGHT
安装类型：BOARD装载的行数：2
选件：GENERAL PURPOSE端子节距：1 mm
端接类型：SOLDER触点总数：240
UL 易燃性代码：94V-0Base Number Matches：1

0780790101 数据手册

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This document was generated on 05/10/2010  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  
Part Number:  
Status:  
0780790101  
Active  
Description:  
1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal  
Pins, Off-White Housing and Latches, 0.38µm (15µ") Gold (Au) Plating, 2.67mm(.105")  
Soldertail, 240 Circuits, Lead free  
Documents:  
3D Model  
Drawing (PDF)  
Product Specification PS-78079-001 (PDF)  
RoHS Certificate of Compliance (PDF)  
Series  
image - Reference only  
China RoHS  
Agency Certification  
CSA  
UL  
LR19980  
E29179  
EU RoHS  
ELV and RoHS  
Compliant  
General  
REACH SVHC  
Contains SVHC: No  
Halogen-Free  
Status  
Product Family  
Series  
Component Type  
JEDEC Outline  
Product Name  
Memory Module Sockets  
78079  
Socket  
MO-269  
DDR3 DIMM  
Not Halogen-Free  
Need more information on product  
environmental compliance?  
Physical  
Circuits (Loaded)  
240  
240  
Email productcompliance@molex.com  
Circuits (maximum)  
For a multiple part number RoHS Certificate of  
Compliance, click here  
Color - Resin  
Durability (mating cycles max)  
Entry Angle  
Flammability  
Keying to Mating Part  
Material - Metal  
Natural  
25  
Vertical  
94V-0  
Yes  
Copper Alloy  
Please visit the Contact Us section for any  
non-product compliance questions.  
Material - Plating Mating  
Material - Plating Termination  
Material - Resin  
PC Tail Length (in)  
PC Tail Length (mm)  
PCB Locator  
Gold  
Tin  
Search Parts in this Series  
78079Series  
High Temperature Thermoplastic  
0.105 In  
2.67 mm  
Yes  
Mates With  
PCB Retention  
Yes  
JEDEC standard 1.27mm modules  
PCB Thickness Recommended (in)  
PCB Thickness Recommended (mm)  
Packaging Type  
0.062 In  
1.57 mm  
Tray  
Pitch - Mating Interface (in)  
Pitch - Mating Interface (mm)  
Pitch - Term. Interface (in)  
Pitch - Term. Interface (mm)  
Plating min: Mating (µin)  
Plating min: Mating (µm)  
Plating min: Termination (µin)  
Plating min: Termination (µm)  
Temperature Range - Operating  
Termination Interface: Style  
0.039 In  
1.00 mm  
0.039 In  
1.00 mm  
15  
0.38  
100  
2.54  
-55°C to +85°C  
Through Hole  
Electrical  
Current - Maximum per Contact  
Voltage - Maximum  
Voltage Key  
1A  
30V AC (RMS)/DC  
Center  
Solder Process Data  
1234567...18

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