Datasheet > 0603ESDA2-TR2

0603ESDA2-TR2

更新时间： 2024-09-15 12:50:59

品牌	Logo	应用领域
库柏 - COOPER		/
页数	文件大小	规格书
2页	400K
描述
0603ESDA2-TR2 ESD Suppressor PolySurg Series

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中文翻译

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0603ESDA2-TR2 数据手册

HALOGEN

0603ESDA2-TR2 ESD Suppressor

PolySurg^™Series

FREE

Applications

• Computers and peripherals • HDTV Equipment

• Blu-Ray/DVD players

• Satellite and HD radio

• PDAs

• Digital camcorders

• Set top Boxes

• A/V Equipment

• Cell phones

• Digital still cameras

• MP3 / Multimedia players

• External storage

• GPS

• DSL Modems

• High speed data ports

- USB 2.0/3.0

- IEEE 1394

- DVI

- HDMI

- High speed ethernet

- Infiniband^®

Part Numbering System: 0603

Package size

ESDA

TR2

Product family

Surface Mount Device

Second generation designator

Packaging code

Description

Packaging

• 5000 pieces in paper tape on 7 inch diameter (178mm) reel per

EIA Standard 481.

The second generation PolySurg™ 0603ESDA2-TR2 ESD Suppressors

protect valuable high-speed data circuits from ESD damage without distorting

data signals as a result of its ultra-low (0.15pF maximum) capacitance.

Packaging Code

Features

• Lead free, halogen free materials

• 0603/1608 footprint surface mount device

• Ideal ESD protection for high frequency, low voltage applications

• Exceeds testing requirements of IEC 61000-4-2

• Ultra low capacitance (0.15pF maximum)

• Very low leakage current

Package Code Suffix Description

5000 pieces in paper tape on 7 inch diameter

-TR2

(178mm) reel per EIA Standard 481

Device Marking

• Fast response time

• Bi-directional

PolySurg™ ESD Suppressors are marked on the tape and reel packages, not

individually. Since the product is bi-directional and symmetrical, no orientation

marking is required.

Specifications

Performance Characteristics

Continuous Operating Voltage

Clamping Voltage¹

Units

Vdc

°C

Min

- -

-55

Typ

350

0.10

<0.1

30 Typ.

+25

>500

Max

- -

0.15

100

+105

- -

Design Consideration

The location in the circuit for the 0603ESDA2-TR2 Series has to be carefully

determined. For better performance, the device should be placed as close to

the signal input as possible and ahead of any other component. Due to the

high current associated with an ESD event, it is recommended to use a

“0-stub” pad design (pad directly on the signal/data line and second pad

directly on common ground).

Trigger Voltage²

ESD Threat Voltage Capability

Capacitance (@ 1MHz)

Leakage Current (@ 12Vdc)

Peak Current

Operating Temperature

ESD Pulse Withstand

# Pulses

Processing Recommendations

1. Per IEC 61000-4-2, 30A @ 8kV, Level 4, contact discharge, measurement made 30ns

after initiation of pulse.

2. Trigger measurement made using Transmission Line Pulse (TLP) method.

The 0603ESDA2-TR2 Series currently has a convex profile on the top surface

of the part. This profile is a result of the construction of the device. They can

be processed using standard pick-and-place equipment. The placement and

processing techniques for these devices are similar to those used for chip

resistors and chip capacitors.

0612 BU-SB12433

Page 1 of 2

Data Sheet 4419

中文翻译

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