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YHC514N-220MA PDF预览

YHC514N-220MA

更新时间: 2024-11-16 00:56:23
品牌 Logo 应用领域
台庆 - TAI-TECH /
页数 文件大小 规格书
2页 136K
描述
SMD Power Inductor

YHC514N-220MA 数据手册

 浏览型号YHC514N-220MA的Datasheet PDF文件第2页 
P1  
TAI-TECH  
SMD Power Inductor  
YHC514N-Series  
1. Features  
Halogen  
1. This specification applies Low Profile Power Inductors.  
2. 100% Lead(Pb) & Halogen-Free and RoHS compliant.  
3. Operating temperature :-40~+125(Including self-temperature rise)  
Halogen-free  
Recommended Land pattern  
2. Dimensions  
G(mm)  
H(mm)  
I(mm)  
Series  
Inductance A(mm) B(mm) C(mm) D(mm) E(mm) F(mm)  
2.1  
4.2  
1.5  
10uH  
10uH  
3.9±0.2  
3.8±0.2  
YHC514N  
4.95±0.2 4.95±0.2  
1.3±0.3 4.2±0.2  
3.7ref  
Note: 1. The above PCB layout reference only.  
2. Recommend solder paste thickness at  
0.12mm and above.  
3. Part Numbering  
YHC  
514  
N
-
100  
M
A
A
B
C
D
E
F
A: Series  
B: Dimension  
A/B*C  
C: Type  
D: Inductance  
E: Inductance Tolerance  
100=10uH  
M=±20%  
marking direction cannot decide polarity. Color: Black, unidirectional.  
magnetic shielding  
F: Code  
4. Specification  
Rated current  
DCR  
Inductance  
L0 (uH)  
@ 0 A  
Tolerance  
Tempetature  
Saturation  
current  
Part Number  
(m) @25  
±20%  
current  
K
L
M
Y
I rms (A)  
I sat (A)  
YHC514N-1R0A  
YHC514N-2R2A  
YHC514N-4R7A  
YHC514N-100A  
YHC514N-220A  
YHC514N-330A  
YHC514N-470A  
1.00  
2.20  
4.70  
10.0  
22.0  
33.0  
47.0  
/
/
±20%  
±20%  
±20%  
±20%  
±20%  
±20%  
±20%  
±30%  
±30%  
±30%  
±30%  
±30%  
±30%  
±30%  
5.00  
3.80  
3.20  
2.20  
1.50  
1.20  
1.00  
7.50  
5.70  
3.90  
2.52  
1.62  
1.30  
1.10  
12  
21  
/
/
/
/
32  
/
/
56  
/
±15%  
±15%  
±15%  
123  
180  
270  
/
±10%  
”:K±10%,L±15%,M±20%,Y±30%.  
Note:  
1. All test data referenced to 25ambient , Ls/Q:100KHz/1V.  
2. Testing Instrument : HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH502BC MICRO OHMMETER.  
3. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40.  
4. Saturation Current (Isat) will cause L0 to drop approximately 30%.  
5. The part temperature (ambient + temp rise) should not exceed 125under worst case operating conditions.Circuit design,component,PCB trace size and  
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.  
6. Special inquiries besides the above common used types can be met on your requirement.  
www.tai-tech.com.tw  

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