Datasheet > YHC814N-2R2MA

YHC814N-2R2MA

更新时间： 2024-11-16 00:57:23

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SMD Power Inductor

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数据手册

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YHC814N-2R2MA 数据手册

TAI-TECH

SMD Power Inductor

YHC814N-Series

1. Features

Halogen

1. This specification applies Low Profile Power Inductors.

2. 100% Lead(Pb) & Halogen-Free and RoHS compliant.

3. Operating temperature :-40~+125℃(Including self-temperature rise)

Halogen-free

Recommended Land pattern

2. Dimensions

2R2

Series

YHC814N

Inductance

＜10uH

A(mm) B(mm) B’(mm) C(mm) D(mm) E(mm) F(mm)

L(mm) G(mm) H(mm) G1(mm)

8.5

4.2Max

5.5

6.3

2.5

8.0±0.3 8.0±0.3 6.3±0.2

2.0±0.3 6.0±0.3 5.5±0.3

Note: 1. The above PCB layout reference only.

2. Recommend solder paste thickness at

0.15mm and above.

≥10uH

3.7±0.3

3. Part Numbering

YHC

814

2R2

A: Series

B: Dimension

A/B*C

C: Type

D: Inductance

E: Inductance Tolerance

2R2=2.20uH

M=±20%

marking direction cannot decide polarity. Color: Black, unidirectional.

magnetic shielding

F:Code

4. Specification

Rated current

Inductance

L0 (uH)

@ 0 A

DCR

(mΩ) @25℃

±20%

Temperature current Saturation current

I rms (A) I sat (A)

Tolerance

Part Number

Typ

Max

Typ

Max

YHC814N-1R0□A

YHC814N-2R2□A

YHC814N-4R7□A

YHC814N-100□A

YHC814N-220□A

YHC814N-330□A

YHC814N-470□A

1.00

2.20

4.70

10.0

22.0

33.0

47.0

±20% ±30%

8.50

7.40

5.80

4.60

2.90

2.30

2.00

8.00

6.90

5.30

4.20

2.45

2.10

1.70

13.80

9.80

6.70

5.00

3.10

2.60

2.20

13.00

9.20

6.00

4.30

2.80

2.10

1.90

8.2

11.5

19.5

33.0

73.0

100

135

±15% ±20% ±30%

±10% ±15% ±20% ±30%

“□”:K±10%,L±15%,M±20%,Y±30%.

Note:

1. All test data referenced to 25℃ ambient , Ls/Q:1MHz/1V.

2. Testing Instrument : HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH502BC MICRO OHMMETER.

3. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃

4. Saturation Current (Isat) will cause L0 to drop approximately 30%

5. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and

thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

6. Special inquiries besides the above common used types can be met on your requirement.

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