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YHC814N-470MA PDF预览

YHC814N-470MA

更新时间: 2024-11-16 00:57:23
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台庆 - TAI-TECH /
页数 文件大小 规格书
2页 168K
描述
SMD Power Inductor

YHC814N-470MA 数据手册

 浏览型号YHC814N-470MA的Datasheet PDF文件第2页 
P1  
TAI-TECH  
SMD Power Inductor  
YHC814N-Series  
1. Features  
Halogen  
1. This specification applies Low Profile Power Inductors.  
2. 100% Lead(Pb) & Halogen-Free and RoHS compliant.  
3. Operating temperature :-40~+125(Including self-temperature rise)  
Halogen-free  
Recommended Land pattern  
2. Dimensions  
2R2  
Series  
YHC814N  
Inductance  
10uH  
A(mm) B(mm) B’(mm) C(mm) D(mm) E(mm) F(mm)  
L(mm) G(mm) H(mm) G1(mm)  
8.5  
4.2Max  
5.5  
6.3  
2.5  
8.0±0.3 8.0±0.3 6.3±0.2  
2.0±0.3 6.0±0.3 5.5±0.3  
Note: 1. The above PCB layout reference only.  
2. Recommend solder paste thickness at  
0.15mm and above.  
10uH  
3.7±0.3  
3. Part Numbering  
YHC  
814  
N
-
2R2  
M
A
A
B
C
D
E
F
A: Series  
B: Dimension  
A/B*C  
C: Type  
D: Inductance  
E: Inductance Tolerance  
2R2=2.20uH  
M=±20%  
marking direction cannot decide polarity. Color: Black, unidirectional.  
magnetic shielding  
F:Code  
4. Specification  
Rated current  
Inductance  
L0 (uH)  
@ 0 A  
DCR  
(m) @25  
±20%  
Temperature current Saturation current  
I rms (A) I sat (A)  
Tolerance  
Part Number  
K
L
M
Y
Typ  
Max  
Typ  
Max  
YHC814N-1R0A  
YHC814N-2R2A  
YHC814N-4R7A  
YHC814N-100A  
YHC814N-220A  
YHC814N-330A  
YHC814N-470A  
1.00  
2.20  
4.70  
10.0  
22.0  
33.0  
47.0  
/
/
/
/
/
±20% ±30%  
±20% ±30%  
8.50  
7.40  
5.80  
4.60  
2.90  
2.30  
2.00  
8.00  
6.90  
5.30  
4.20  
2.45  
2.10  
1.70  
13.80  
9.80  
6.70  
5.00  
3.10  
2.60  
2.20  
13.00  
9.20  
6.00  
4.30  
2.80  
2.10  
1.90  
8.2  
11.5  
19.5  
33.0  
73.0  
100  
135  
±15% ±20% ±30%  
±10% ±15% ±20% ±30%  
±10% ±15% ±20% ±30%  
±10% ±15% ±20% ±30%  
±10% ±15% ±20% ±30%  
”:K±10%,L±15%,M±20%,Y±30%.  
Note:  
1. All test data referenced to 25ambient , Ls/Q:1MHz/1V.  
2. Testing Instrument : HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH502BC MICRO OHMMETER.  
3. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40  
4. Saturation Current (Isat) will cause L0 to drop approximately 30%  
5. The part temperature (ambient + temp rise) should not exceed 125under worst case operating conditions.Circuit design,component,PCB trace size and  
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.  
6. Special inquiries besides the above common used types can be met on your requirement.  
www.tai-tech.com.tw  

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