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YFS-20-L3-H-06-MSB-K PDF预览

YFS-20-L3-H-06-MSB-K

更新时间: 2024-11-21 05:37:03
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申泰 - SAMTEC /
页数 文件大小 规格书
2页 751K
描述
IC Socket

YFS-20-L3-H-06-MSB-K 数据手册

 浏览型号YFS-20-L3-H-06-MSB-K的Datasheet PDF文件第2页 
REVISION Q  
YFS-XX-X3-X-XX-XSB-XX  
"F" REF  
OPTION  
"G" REF  
No OF POSITIONS  
-K: KAPTON PAD  
(SEE FIG 2, SHT 2)  
-TR: TAPE & REEL  
(SEE NOTE 17)  
-20, -30, -40, -50  
DO NOT  
C
(PER ROW)  
SCALE FROM  
THIS PRINT  
((No OF POS -1) x .0500[1.270]))  
.035 0.89 REF  
.0020[.051]  
"B"  
SOLDER BALLS  
LEAD STYLE  
-SB: SOLDER BALL  
-03: PIN / SOLDERBALLS  
(USE C-140-03-X, SEE FIG 1)  
-L3: PIN / SOLDERBALLS  
(LOW INSERTION FORCE)  
(USE C-226-03-X)  
(USE SDB-030-6337)  
37% Pb/63% Sn  
* -MSB: MODIFIED SOLDER BALL  
(USE SDB-030-9653, Pb  
FREE,SEE NOTE 14)  
"A"  
"B"  
REF  
.145 3.68  
REF  
PLATING SPECIFICATION  
96.5% S/3% Ag/0.5% Cu  
-G: GOLD (USE C-XXX-03-G)  
(SEE NOTE 7)  
"A"  
ROW SPECIFICATION  
-H: HEAVY GOLD (USE C-XXX-03-H)  
-E: EXTRA GOLD (USE C-XXX-03-E)  
(SEE NOTE 7)  
-05: FIVE (USE YFSP-XX-01-F)  
-08: EIGHT (USE YFSP-XX-01-E)  
-10: TEN (USE YFSP-XX-01-T)  
-06: SIX (USE YFSP-XX-01-6)  
(AVAILABLE IN 20 POS ONLY)  
-03: THREE (USE YFSP-XX-01-3)  
(AVAILABLE IN 20 POS ONLY)  
(SEE NOTE 17)  
"A"  
02  
"B"  
01  
YFSP-XX-01-X  
09 (PIN # = NO. OF ROWS +1)  
C-XXX-03-X  
* = NOT ENGINEERING APPROVED  
'A'  
.134±.003 3.41±0.08  
.104 2.64  
REF  
.012 0.312  
(SEE NOTE 9)  
SDB-030-XXXX  
SECTION "B"-"B"  
NOTES:  
C
1.  
REPRESENTS A CRITICAL DIMENSION.  
2. NOTE DELETED.  
SECTION "A"-"A"  
3. MAXIMUM BURR ALLOWANCE: .0005[0.013]  
4. MINIMUM PUSHOUT FORCE: .5 LB.  
5. NOTE DELETED.  
6. CONTACT TO BE FLUSH .002[0.05].  
TO BE MEASURED AT ALL FOUR CORNERS.  
7. ONE REEL MINIMUM PLATING REQUIREMENT  
(85,000 CONTACTS PER REEL)  
8. ALL DIMS TO BE SYMMETRICAL ABOUT THE  
CENTERLINE WITHIN .001[0.03].  
9. .0025[0.064] MAX VARIATION BETWEEN  
SOLDERBALLS.  
.095 2.41  
REF  
10. REFER TO VISUAL INSPECTION BOARD FOR  
SOLDERBALL APPEARANCE CHECKS.  
11. THE DISTANCE FROM THE CENTER OF ANY  
SOLDERBALL TO THE CENTER OF ANY  
ADJACENT INNER PEG SHALL BE  
.025 .005[0.64 0.13].  
12. NOTE DELETED.  
13. NOTE DELETED.  
14. CONTACT SAMTEC CES DEPARTMENT FOR  
PROCESSING INFORMATION.  
FIG 1  
15. NOTE DELETED.  
16. NO FLASH ALLOWED ON THE PIN TIPS.  
17. IF -TR OPTION IS NOT SPECIFIED, PARTS TO BE  
PACKAGED IN TRAYS. PARTS WITH -03 ROW  
SPECIFICATION NOT VALID WITHOUT -TR OPTION.  
YFS-20-X3-X-08-XSB SHOWN  
IN-PROCESS WITHOUT SOLDERBALLS  
PROPRIETARY NOTE  
UNLESS OTHERWISE SPECIFIED,  
DIMENSIONS ARE IN INCHES.  
TOLERANCES ARE:  
THIS DOCUMENT CONTAINS INFORMATION  
CONFIDENTIAL AND PROPRIETARY TO  
SEE NOTE 6  
SAMTEC, INC. AND SHALL NOT BE REPRODUCED  
OR TRANSFERRED TO OTHER DOCUMENTS OR  
DISCLOSED TO OTHERS OR USED FOR ANY  
PURPOSE OTHER THAN THAT WHICH IT WAS  
OBTAINED WITHOUT THE EXPRESSED WRITTEN  
CONSENT OF SAMTEC, INC.  
DECIMALS  
ANGLES  
2
.XX: .01[.3]  
520 PARK EAST BLVD, NEW ALBANY, IN 47150  
.XXX: .005[.13]  
PHONE: 812-944-6733  
FAX: 812-948-5047  
code 55322  
.XXXX: .0020[.051]  
e-Mail info@SAMTEC.com  
SHEET SCALE: 2.5:1  
DO NOT SCALE DRAWING  
DESCRIPTION:  
MATERIAL:  
.050[1.27] MULTI-ROW SOCKET ASSEMBLY  
DWG. NO.  
INSULATOR: LCP, COLOR: BLACK  
CONTACT: PHOS BRONZE  
DETAIL 'A'  
SCALE 5 : 1  
YFS-XX-X3-X-XX-XSB-XX  
SEE NOTE 16  
BY:  
KEVIN B  
4/22/99  
SHEET 1 OF 2  
F:\DWG\MISC\MKTG\YFS-XX-X3-X-XX-XSB-XX-MKT.SLDDRW  

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