Datasheet > YFS-20-L3-H-08-MSB-TR

YFS-20-L3-H-08-MSB-TR

更新时间： 2024-11-20 19:15:03

品牌	Logo	应用领域
申泰 - SAMTEC		/
页数	文件大小	规格书
2页	801K
描述
IC Socket, BGA160, 160 Contact(s),

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技术参数
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YFS-20-L3-H-08-MSB-TR 技术参数

生命周期：	Active	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8536.69.40.40
风险等级：	5.69	Is Samacsys：	N
联系完成配合：	GOLD	联系完成终止：	GOLD
设备插槽类型：	IC SOCKET	使用的设备类型：	BGA160
外壳材料：	LIQUID CRYSTAL POLYMER	JESD-609代码：	e4
触点数：	160	Base Number Matches：	1

YFS-20-L3-H-08-MSB-TR 数据手册

浏览型号YFS-20-L3-H-08-MSB-TR的Datasheet PDF文件第2页

REVISION H

YFS-XX-X3-X-XX-XSB-XX

(No OF POS x .0500[1.270]) + .120[3.05] REF

(No OF POS x .0500[1.270]) + .020[.51] REF

OPTION

-K: KAPTON PAD

(SEE FIG. 2, SHT. 2)

-TR: TAPE & REEL

No OF POSITIONS

-20, -30, -40, -50

DO NOT

SCALE FROM

THIS PRINT

(PER ROW)

((No OF POS -1) x .0500[1.270]))

.035 0.89 REF

SOLDER BALLS

-SB: SOLDER BALL

.0020[.051]

"B"

LEAD STYLE

(USE SDB-030-6337)

-MSB: MODIFIED SOLDER BALL

(USE SDB-030-9653, Pb

-03: PIN / SOLDERBALLS

(USE C-140-03-X, SEE FIG. 1)

-L3: PIN / SOLDERBALLS

(LOW INSERTION FORCE)

(USE C-226-03-X)

FREE,SEE NOTE 14)

"A" EQ SPACES

@ .0500[1.270]

ROW SPECIFICATION

"B"

REF

.145 3.68

REF

-05: FIVE (USE YFSP-XX-01-F)

-08: EIGHT (USE YFSP-XX-01-E)

-10: TEN (USE YFSP-XX-01-T)

-06: SIX (USE YFSP-XX-01-6)

(AVAILABLE IN 20 POS. ONLY)

-03: THREE (USE YFSP-XX-01-3)

(AVAILABLE IN 20 POS. ONLY)

PLATING SPECIFICATION

-G: GOLD (USE C-XXX-03-G)

(SEE NOTE 7)

-H: HEAVY GOLD (USE C-XXX-03-H)

-E: EXTRA GOLD (USE C-XXX-03-E)

(SEE NOTE 7)

"A"

"B"

* = NOT ENGINEERING APPROVED

09 (PIN # = NO. OF ROWS +1)

C-XXX-03-X

YFSP-XX-01-X

SEE NOTE 6

NOTES:

REPRESENTS A CRITICAL DIMENSION.

.134±.003 3.41±0.08

2. NOTE DELETED.

3. BURR ALLOWANCE: .0005[0.013] MAX.

4. MINIMUM PUSHOUT FORCE: .5 LB.

5. NOTE DELETED.

.104 2.64

REF

6. CONTACT TO BE FLUSH .002[0.05] RECESSED.

7. ONE REEL MINIMUM PLATING REQUIREMENT

(85,000 CONTACTS PER REEL)

8. ALL DIMS TO BE SYMMETRICAL ABOUT THE

CENTERLINE WITHIN .001[0.03].

9. .0025[0.064] MAX VARIATION BETWEEN

SOLDERBALLS.

'A'

.012 0.31

(SEE NOTE 9)

SECTION "B"-"B"

SECTION "A"-"A"

SDB-030-XXXX

10. REFER TO VISUAL INSPECTION BOARD FOR

SOLDERBALL APPEARANCE CHECKS.

11. THE DISTANCE FROM THE CENTER OF ANY

SOLDERBALL TO THE CENTER OF ANY

ADJACENT INNER PEG SHALL BE

.025 .005[0.64 0.13].

12. SOLDER JOINTS TO BE INSPECTED PER IPC

SPECIFICATION 12.2.12 (IPC-A-610C).

13. NOTE DELETED

14. CONTACT SAMTEC CES DEPARTMENT FOR

PROCESSING INFORMATION.

.095 2.41

REF

PROPRIETARY NOTE

UNLESS OTHERWISE SPECIFIED,

DIMENSIONS ARE IN INCHES.

TOLERANCES ARE:

IN-PROCESS WITHOUT SOLDERBALLS

THIS DOCUMENT CONTAINS INFORMATION

CONFIDENTIAL AND PROPRIETARY TO

SAMTEC, INC. AND SHALL NOT BE REPRODUCED

OR TRANSFERRED TO OTHER DOCUMENTS OR

DISCLOSED TO OTHERS OR USED FOR ANY

PURPOSE OTHER THAN THAT WHICH IT WAS

OBTAINED WITHOUT THE EXPRESSED WRITTEN

CONSENT OF SAMTEC, INC.

DECIMALS

ANGLES

.XX: .01[.3]

520 PARK EAST BLVD, NEW ALBANY, IN 47150

.XXX: .005[.13]

PHONE: 812-944-6733

FAX: 812-948-5047

.XXXX: .0020[.051]

e-Mail info@SAMTEC.com

code 55322

SHEET SCALE: 2.5:1

DO NOT SCALE DRAWING

DESCRIPTION:

MATERIAL:

.050[1.27] MULTI-ROW SOCKET ASM.

YFS-XX-X3-X-XX-XSB-XX

INSULATOR: LCP, COLOR: BLACK

CONTACT: PHOS BRONZE

DWG. NO.

DETAIL 'A'

SCALE 5 : 1

KEVIN B

4/22/99

SHEET 1 OF 2

BY:

F:\dwg\misc\mktg\YFS-XX-X3-X-XX-XSB-XX-MKT.SLDDRW

中文翻译

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与YFS-20-L3-H-08-MSB-TR相关器件

型号	品牌	获取价格	描述	数据表
YFS-20-L3-H-10-MSB	SAMTEC	获取价格	IC Socket
YFS-20-L3-H-10-SB-TR	SAMTEC	获取价格	暂无描述
YFS-30-03-E-03-MSB-K	SAMTEC	获取价格	IC Socket, BGA90, 90 Contact(s),
YFS-30-03-E-03-MSB-TR	SAMTEC	获取价格	IC Socket, BGA90, 90 Contact(s),
YFS-30-03-E-03-SB-K	SAMTEC	获取价格	IC Socket, BGA90, 90 Contact(s),
YFS-30-03-E-03-SB-TR	SAMTEC	获取价格	IC Socket, BGA90, 90 Contact(s),
YFS-30-03-E-05-MSB-K	SAMTEC	获取价格	IC Socket, BGA150, 150 Contact(s),
YFS-30-03-E-06-MSB-K	SAMTEC	获取价格	IC Socket, BGA180, 180 Contact(s),
YFS-30-03-E-06-SB-K	SAMTEC	获取价格	IC Socket, BGA180, 180 Contact(s),
YFS-30-03-E-06-SB-TR	SAMTEC	获取价格	IC Socket, BGA180, 180 Contact(s),

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