Datasheet > YFS-30-03-E-10-SB-K

YFS-30-03-E-10-SB-K

更新时间： 2024-11-21 04:31:35

品牌	Logo	应用领域
申泰 - SAMTEC		/
页数	文件大小	规格书
2页	661K
描述
IC Socket, BGA300, 300 Contact(s),

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YFS-30-03-E-10-SB-K 数据手册

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REVISION W

YFS-XX-X3-X-XX-SB-XX

"F" REF

OPTION

"G" REF

No OF POSITIONS

-K: KAPTON PAD

(SEE FIG 2, SHT 2)

-TR: TAPE & REEL

(SEE NOTE 17)

-20, -30, -40, -50

DO NOT

SCALE FROM

THIS PRINT

(PER ROW)

((No OF POS -1) x .0500[1.270]))

.0020[.051]

.035 0.89 REF

"B"

SOLDER BALLS

LEAD STYLE

-SB: SOLDER BALL

(USE SDB-030-6337)

37% Pb/63% Sn

-03: PIN / SOLDERBALLS

(USE C-140-03-X, SEE FIG 1)

-L3: PIN / SOLDERBALLS

(LOW INSERTION FORCE)

(USE C-226-03-X)

"A"

"B"

REF

.145 3.68

REF

PLATING SPECIFICATION

-G: GOLD (USE C-XXX-03-G)

-H: HEAVY GOLD (USE C-XXX-03-H)

-E: EXTRA GOLD (USE C-XXX-03-E)

"A"

ROW SPECIFICATION

-05: FIVE (USE YFSP-XX-01-F)

-08: EIGHT (USE YFSP-XX-01-E)

-10: TEN (USE YFSP-XX-01-T)

-06: SIX (USE YFSP-XX-01-6)

(AVAILABLE IN 20 POS ONLY)

-03: THREE (USE YFSP-XX-01-3)

(AVAILABLE IN 20 POS ONLY)

(SEE NOTE 17)

"A"

"B"

YFSP-XX-01-X

09 (PIN # = NO. OF ROWS +1)

C-XXX-03-X

'A'

.130±.003 3.31±0.08

.104 2.64

REF

.008 0.208

(SEE NOTE 9)

SDB-030-XXXX

SECTION "B"-"B"

NOTES:

REPRESENTS A CRITICAL DIMENSION.

SEE NOTE 18

2. NOTE DELETED.

SECTION "A"-"A"

3. MAXIMUM BURR ALLOWANCE: .0005[0.013]

4. MINIMUM PUSHOUT FORCE: .5 LB.

5. NOTE DELETED.

6. CONTACT TO BE FLUSH .002[0.05].

TO BE MEASURED AT ALL FOUR CORNERS.

7. NOTE DELETED.

8. ALL DIMS TO BE SYMMETRICAL ABOUT THE

CENTERLINE WITHIN .001[0.03].

9. .0025[0.064] MAX VARIATION BETWEEN

SOLDERBALLS.

.095 2.41

REF

10. REFER TO VISUAL INSPECTION BOARD FOR

SOLDERBALL APPEARANCE CHECKS.

11. THE DISTANCE FROM THE CENTER OF ANY

SOLDERBALL TO THE CENTER OF ANY

ADJACENT INNER PEG SHALL BE

.025 .005[0.64 0.13].

12. NOTE DELETED.

13. NOTE DELETED.

14. NOTE DELETED.

15. NOTE DELETED.

16. NO FLASH ALLOWED ON THE PIN TIPS.

17. IF -TR OPTION IS NOT SPECIFIED, PARTS TO BE

PACKAGED IN TRAYS. PARTS WITH -03 ROW

SPECIFICATION NOT VALID WITHOUT -TR OPTION.

18. THE FLAT IS FOR REFERENCE ONLY. SOLDERBALLS

MAY NOT ACTUALLY BE FLAT AFTER REPRESS.

FIG 1

YFS-20-X3-X-08-SB SHOWN

IN-PROCESS WITHOUT SOLDERBALLS

PROPRIETARY NOTE

UNLESS OTHERWISE SPECIFIED,

DIMENSIONS ARE IN INCHES.

TOLERANCES ARE:

THIS DOCUMENT CONTAINS INFORMATION

CONFIDENTIAL AND PROPRIETARY TO

SEE NOTE 6

SAMTEC, INC. AND SHALL NOT BE REPRODUCED

OR TRANSFERRED TO OTHER DOCUMENTS OR

DISCLOSED TO OTHERS OR USED FOR ANY

PURPOSE OTHER THAN THAT WHICH IT WAS

OBTAINED WITHOUT THE EXPRESSED WRITTEN

CONSENT OF SAMTEC, INC.

DECIMALS

ANGLES

.XX: .01[.3]

520 PARK EAST BLVD, NEW ALBANY, IN 47150

.XXX: .005[.13]

PHONE: 812-944-6733

FAX: 812-948-5047

code 55322

.XXXX: .0020[.051]

e-Mail info@SAMTEC.com

SHEET SCALE: 2.5:1

DO NOT SCALE DRAWING

DESCRIPTION:

MATERIAL:

.050[1.27] MULTI-ROW SOCKET ASSEMBLY

DWG. NO.

INSULATOR: LCP, COLOR: BLACK

CONTACT: PHOS BRONZE

DETAIL 'A'

SCALE 5 : 1

YFS-XX-X3-X-XX-SB-XX

SEE NOTE 16

BY:

KEVIN B

4/22/99

SHEET 1 OF 2

F:\DWG\MISC\MKTG\YFS-XX-X3-X-XX-SB-XX-MKT.SLDDRW

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与YFS-30-03-E-10-SB-K相关器件

型号	品牌	获取价格	描述	数据表
YFS-30-03-E-10-SB-TR	SAMTEC	获取价格	IC Socket, BGA300, 300 Contact(s),
YFS-30-03-E-F-SB-K	SAMTEC	获取价格	IC Socket, BGA150, 150 Contact(s),
YFS-30-03-E-F-SB-TR	SAMTEC	获取价格	IC Socket, BGA150, 150 Contact(s),
YFS-30-03-G-03-MSB-TR	SAMTEC	获取价格	IC Socket, BGA90, 90 Contact(s),
YFS-30-03-G-05-MSB	SAMTEC	获取价格	IC Socket
YFS-30-03-G-05-MSB-TR	SAMTEC	获取价格	IC Socket, BGA150, 150 Contact(s),
YFS-30-03-G-05-SB	SAMTEC	获取价格	IC Socket,
YFS-30-03-G-05-SB-TR	SAMTEC	获取价格	IC Socket, BGA150, 150 Contact(s),
YFS-30-03-G-06-MSB-TR	SAMTEC	获取价格	IC Socket, BGA180, 180 Contact(s),
YFS-30-03-G-06-SB-K	SAMTEC	获取价格	IC Socket, BGA180, 180 Contact(s),

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