Datasheet > XPC107APX100LC

XPC107APX100LC

更新时间： 2024-02-23 11:42:54

品牌	Logo	应用领域
恩智浦 - NXP		时钟 PC
页数	文件大小	规格书
49页	466K
描述
IC,PERIPHERAL (MULTIFUNCTION) CONTROLLER,CMOS,BGA,503PIN

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XPC107APX100LC 技术参数

是否Rohs认证：	不符合	生命周期：	Transferred
零件包装代码：	BGA	包装说明：	33 X 33 MM, 2.75 HEIGHT, 1.27 MM PITCH, PLASTIC, FC-PBGA-503
针数：	503	Reach Compliance Code：	compliant
HTS代码：	8542.39.00.01	风险等级：	5.85
边界扫描：	YES	总线兼容性：	PCI
最大时钟频率：	66 MHz	JESD-30 代码：	S-PBGA-B503
JESD-609代码：	e0	长度：	33 mm
端子数量：	503	封装主体材料：	PLASTIC/EPOXY
封装代码：	BGA	封装等效代码：	BGA503,25X25,50
封装形状：	SQUARE	封装形式：	GRID ARRAY
峰值回流温度（摄氏度）：	NOT SPECIFIED	电源：	2.5,2.5/3.3,3.3 V
认证状态：	Not Qualified	RAM（字数）：	256
座面最大高度：	2.75 mm	子类别：	Other Microprocessor ICs
最大供电电压：	2.625 V	最小供电电压：	2.375 V
标称供电电压：	2.5 V	表面贴装：	YES
技术：	CMOS	端子面层：	Tin/Lead (Sn/Pb)
端子形式：	BALL	端子节距：	1.27 mm
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	33 mm	Base Number Matches：	1

XPC107APX100LC 数据手册

Advance Information

MPC107EC/D

Rev. 1, 11/2002

MPC107

PCI Bridge/Memory

Controller

Hardware Speciﬁcations

This document provides an overview of the MPC107 PCI bridge/memory controller

(PCIB/MC) for high-performance embedded systems. The MPC107 is a cost-effective,

general-purpose PCIB/MC for applications using PCI in networking infrastructure,

telecommunications, and other embedded markets. It can be used in applications such as

network routers and switches, mass storage subsystems, network appliances, and print and

imaging systems.

This document describes pertinent electrical and physical characteristics of the MPC107. For

functional characteristics of the processor, refer to the MPC107 PCI Bridge/Memory

Controller User’s Manual (MPC107UM/D).

This document contains the following topics:

Topic

Page

Section 1.1, “Overview”

Section 1.2, “Features”

Section 1.3, “General Parameters”

Section 1.4, “Electrical and Thermal Characteristics”

Section 1.5, “Package Description”

Section 1.6, “PLL Conﬁguration”

Section 1.7, “System Design Information”

Section 1.8, “Document Revision History”

Section 1.9, “Ordering Information”

To locate any published errata or updates for this document, refer to the web site at

http://www.motorola.com/semiconductors.

1.1 Overview

The MPC107 integrates a PCI bridge, memory controller, DMA controller, PIC timers, a

message unit with an Intelligent Input/Output (I O) message controller, and an

Inter-Integrated Circuit (I C) controller. The integration reduces the overall packaging

requirements and the number of discrete devices required for an embedded system.

Figure 1 shows the major functional units within the MPC107. Note that this is a conceptual

block diagram intended to show basic features rather than an attempt to show how these

features are physically implemented.

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与XPC107APX100LC相关器件

型号	品牌	获取价格	描述	数据表
XPC107APX100LD	NXP	获取价格	IC,PERIPHERAL (MULTIFUNCTION) CONTROLLER,CMOS,BGA,503PIN
XPC107APX100LD	MOTOROLA	获取价格	Multifunction Peripheral, CMOS, PBGA503, 33 X 33 MM, PLASTIC, BGA-503
XPC107APX100LX	MOTOROLA	获取价格	Multifunction Peripheral, CMOS, PBGA503, 33 X 33 MM, PLASTIC, BGA-503
XPC107APX66LC	MOTOROLA	获取价格	Multifunction Peripheral, CMOS, PBGA503, 33 X 33 MM, PLASTIC, BGA-503
XPC107APX66LD	MOTOROLA	获取价格	IC,PERIPHERAL (MULTIFUNCTION) CONTROLLER,CMOS,BGA,503PIN
XPC107APX66LX	MOTOROLA	获取价格	Multifunction Peripheral, CMOS, PBGA503, 33 X 33 MM, PLASTIC, BGA-503
XPC-110XB220A1	CTS	获取价格	Fixed Resistor, Wire Wound, 2W, 22ohm, 10% +/-Tol
XPC-110XB330B1	CTS	获取价格	Fixed Resistor, Wire Wound, 2W, 33ohm, 20% +/-Tol
XPC-110XB390A1	CTS	获取价格	Fixed Resistor, Wire Wound, 2W, 39ohm, 10% +/-Tol
XPC150AC	HONEYWELL	获取价格	Peizoresistive Sensor, Absolute, 0Psi Min, 150Psi Max, Round, Through Hole Mount

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