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XOMAP3503DCBB PDF预览

XOMAP3503DCBB

更新时间: 2024-11-06 13:16:11
品牌 Logo 应用领域
德州仪器 - TI 微控制器和处理器外围集成电路数字信号处理器时钟
页数 文件大小 规格书
262页 3639K
描述
16-BIT, 38.4MHz, MIXED DSP, PBGA515, PLASTIC, FCBGA-515

XOMAP3503DCBB 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:VFBGA,针数:515
Reach Compliance Code:unknownECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:5.76
Is Samacsys:N地址总线宽度:26
桶式移位器:NO边界扫描:YES
最大时钟频率:38.4 MHz外部数据总线宽度:16
格式:FLOATING POINT内部总线架构:MULTIPLE
JESD-30 代码:S-PBGA-B515长度:12 mm
低功率模式:YES端子数量:515
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装形状:SQUARE封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
认证状态:Not Qualified座面最大高度:0.9 mm
最大供电电压:1.89 V最小供电电压:1.71 V
标称供电电压:1.8 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:BALL端子节距:0.5 mm
端子位置:BOTTOM宽度:12 mm
uPs/uCs/外围集成电路类型:DIGITAL SIGNAL PROCESSOR, MIXEDBase Number Matches:1

XOMAP3503DCBB 数据手册

 浏览型号XOMAP3503DCBB的Datasheet PDF文件第2页浏览型号XOMAP3503DCBB的Datasheet PDF文件第3页浏览型号XOMAP3503DCBB的Datasheet PDF文件第4页浏览型号XOMAP3503DCBB的Datasheet PDF文件第5页浏览型号XOMAP3503DCBB的Datasheet PDF文件第6页浏览型号XOMAP3503DCBB的Datasheet PDF文件第7页 
OMAP3515/03 Applications Processor  
www.ti.com  
SPRS505BFEBRUARY 2008REVISED JULY 2008  
1 OMAP3515/03 Applications Processor  
1.1 Features  
112K-Byte ROM  
OMAP3515/03 Applications Processor:  
OMAP™ 3 Architecture  
MPU Subsystem  
64K-Byte Shared SRAM  
Endianess:  
600-MHz ARM Cortex™-A8 Core  
NEON™ SIMD Coprocessor  
ARM Instructions - Little Endian  
ARM Data – Configurable  
2D/3D Graphics Accelerator (OMAP3515  
Device Only)  
External Memory Interfaces:  
SDRAM Controller (SDRC)  
Tile Based Architecture Delivering up to  
10 MPoly/sec  
16, 32-bit Memory Controller With  
1G-Byte Total Address Space  
Interfaces to Low-Power Double Data  
Rate (LPDDR) SDRAM  
SDRAM Memory Scheduler (SMS) and  
Rotation Engine  
Universal Scalable Shader Engine:  
Multi-threaded Engine Incorporating  
Pixel and Vertex Shader Functionality  
Industry Standard API Support:  
OpenGLES 1.1 and 2.0, OpenVG1.0 and  
Direct3D Mobile  
General Purpose Memory Controller  
(GPMC)  
Fine Grained Task Switching, Load  
Balancing, and Power Management  
Programmable High Quality Image  
Anti-Aliasing  
16-bit Wide Multiplexed Address/Data  
Bus  
Up to 8 Chip Select Pins With 128M-Byte  
Address Space per Chip Select Pin  
Glueless Interface to NOR Flash, NAND  
Flash (With ECC Hamming Code  
Fully Software-Compatible With ARM9™  
Commercial and Extended Temperature  
Grades  
Calculation), SRAM and Pseudo-SRAM  
ARM Cortex™-A8 Core  
Flexible Asynchronous Protocol Control  
for Interface to Custom Logic (FPGA,  
CPLD, ASICs, etc.)  
Nonmultiplexed Address/Data Mode  
(Limited 2K-Byte Address Space)  
ARMv7 Architecture  
Trust Zone®  
Thumb®-2  
MMU Enhancements  
System Direct Memory Access (sDMA)  
Controller (32 Logical Channels With  
Configurable Priority)  
In-Order, Dual-Issue, Superscalar  
Microprocessor Core  
NEON™ Multimedia Architecture  
Over 2x Performance of ARMv6 SIMD  
Supports Both Integer and Floating Point  
SIMD  
Jazelle® RCT Execution Environment  
Architecture  
Dynamic Branch Prediction with Branch  
Target Address Cache, Global History  
Buffer, and 8-Entry Return Stack  
Camera Image Signal Processing (ISP)  
CCD and CMOS Imager Interface  
Memory Data Input  
RAW Data Interface  
BT.601/BT.656 Digital YCbCr 4:2:2  
(8-/16-Bit) Interface  
A-Law Compression and Decompression  
Preview Engine for Real-Time Image  
Processing  
Embedded Trace Macrocell (ETM) Support  
for Non-Invasive Debug  
Glueless Interface to Common Video  
Decoders  
Histogram Module/Auto-Exposure,  
Auto-White Balance, and Auto-Focus  
Engine  
ARM Cortex™-A8 Memory Architecture:  
16K-Byte Instruction Cache (4-Way  
Set-Associative)  
16K-Byte Data Cache (4-Way  
Set-Associative)  
Resize Engine  
256K-Byte L2 Cache  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this document.  
is a trademark of ~ Texas Instruments.  
All other trademarks are the property of their respective owners.  
PRODUCT PREVIEW information concerns products in the  
formative or design phase of development. Characteristic data and  
other specifications are design goals. Texas Instruments reserves  
the right to change or discontinue these products without notice.  
Copyright © 2008–2008, Texas Instruments Incorporated  

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IC SPECIALTY MICROPROCESSOR CIRCUIT, PBGA361, 16 X 16 MM, 0.80 MM PITCH, GREEN, PLASTIC, B