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XOMAPL137ZKB3 PDF预览

XOMAPL137ZKB3

更新时间: 2024-09-28 03:08:39
品牌 Logo 应用领域
德州仪器 - TI 微控制器和处理器外围集成电路数字信号处理器
页数 文件大小 规格书
219页 1837K
描述
Low-Power Applications Processor

XOMAPL137ZKB3 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA-256
针数:256Reach Compliance Code:compliant
HTS代码:8542.31.00.01风险等级:5.83
Is Samacsys:NJESD-30 代码:S-PBGA-B256
端子数量:256最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA256,16X16,40
封装形状:SQUARE封装形式:GRID ARRAY
峰值回流温度(摄氏度):NOT SPECIFIED电源:1.2,1.8/3.3 V
认证状态:Not Qualified子类别:Other Microprocessor ICs
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIEDuPs/uCs/外围集成电路类型:DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches:1

XOMAPL137ZKB3 数据手册

 浏览型号XOMAPL137ZKB3的Datasheet PDF文件第2页浏览型号XOMAPL137ZKB3的Datasheet PDF文件第3页浏览型号XOMAPL137ZKB3的Datasheet PDF文件第4页浏览型号XOMAPL137ZKB3的Datasheet PDF文件第5页浏览型号XOMAPL137ZKB3的Datasheet PDF文件第6页浏览型号XOMAPL137ZKB3的Datasheet PDF文件第7页 
OMAP-L137 Low-Power Applications Processor  
www.ti.com  
SPRS563ASEPTEMBER 2008REVISED OCTOBER 2008  
1 OMAP-L137 Low-Power Applications Processor  
1.1 Features  
Six ALU (32-/40-Bit) Functional Units  
Applications  
Supports 32-Bit Integer, SP (IEEE Single  
Precision/32-Bit) and DP (IEEE Double  
Precision/64-Bit) Floating Point  
Supports up to Four SP Additions Per  
Clock, Four DP Additions Every 2  
Clocks  
Supports up to Two Floating Point (SP  
or DP) Approximate Reciprocal or  
Square Root Operations Per Cycle  
Industrial Control  
USB, Networking  
High-Speed Encoding  
Professional Audio  
Software Support  
TI DSP/BIOS™  
Chip Support Library and DSP Library  
Dual Core SoC  
Two Multiply Functional Units  
300-MHz ARM926EJ-S™ RISC MPU  
300-MHz C674x™ VLIW DSP  
Mixed-Precision IEEE Floating Point  
Multiply Supported up to:  
ARM926EJ-S Core  
2 SP x SP -> SP Per Clock  
32-Bit and 16-Bit (Thumb®) Instructions  
DSP Instruction Extensions  
Single Cycle MAC  
ARM® Jazelle® Technology  
EmbeddedICE-RT™ for Real-Time Debug  
2 SP x SP -> DP Every Two Clocks  
2 SP x DP -> DP Every Three Clocks  
2 DP x DP -> DP Every Four Clocks  
Fixed Point Multiply Supports Two 32 x  
32-Bit Multiplies, Four 16 x 16-Bit  
Multiplies, or Eight 8 x 8-Bit Multiplies  
per Clock Cycle, and Complex Multiples  
ARM9 Memory Architecture  
C674x Instruction Set Features  
Instruction Packing Reduces Code Size  
All Instructions Conditional  
Hardware Support for Modulo Loop  
Operation  
Protected Mode Operation  
Exceptions Support for Error Detection and  
Program Redirection  
Superset of the C67x+™ and C64x+™ ISAs  
2400/1800 C674x MIPS/MFLOPS  
Byte-Addressable (8-/16-/32-/64-Bit Data)  
8-Bit Overflow Protection  
Bit-Field Extract, Set, Clear  
Normalization, Saturation, Bit-Counting  
Compact 16-Bit Instructions  
128K-Byte RAM Shared Memory  
Two External Memory Interfaces:  
C674x Two Level Cache Memory Architecture  
32K-Byte L1P Program RAM/Cache  
32K-Byte L1D Data RAM/Cache  
256K-Byte L2 Unified Mapped RAM/Cache  
Flexible RAM/Cache Partition (L1 and L2)  
1024K-Byte L2 ROM  
EMIFA  
NOR (8-/16-Bit-Wide Data)  
NAND (8-/16-Bit-Wide Data)  
16-Bit SDRAM With 128MB Address  
Space  
Enhanced Direct-Memory-Access Controller 3  
(EDMA3):  
EMIFB  
32-Bit or 16-Bit SDRAM With 256MB  
Address Space  
Three Configurable 16550 type UART Modules:  
2 Transfer Controllers  
32 Independent DMA Channels  
8 Quick DMA Channels  
UART0 With Modem Control Signals  
16-byte FIFO  
16x or 13x Oversampling Option  
Programmable Transfer Burst Size  
TMS320C674x™ Floating Point VLIW DSP Core  
Load-Store Architecture With Non-Aligned  
Support  
64 General-Purpose Registers (32 Bit)  
LCD Controller  
Two Serial Peripheral Interfaces (SPI) Each  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this document.  
C674x, TMS320C6000, C6000 are trademarks of Texas Instruments.  
ARM926EJ-S is a trademark of ARM Limited.  
All other trademarks are the property of their respective owners.  
PRODUCT PREVIEW information concerns products in the  
formative or design phase of development. Characteristic data and  
other specifications are design goals. Texas Instruments reserves  
the right to change or discontinue these products without notice.  
Copyright © 2008–2008, Texas Instruments Incorporated  

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