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XDM3730ACBP PDF预览

XDM3730ACBP

更新时间： 2024-01-05 07:08:41
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
280页 2456K
描述
Digital Media Processors

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XDM3730ACBP 技术参数

生命周期：Obsolete零件包装代码：BGA
包装说明：LFBGA,针数：423
Reach Compliance Code：unknown风险等级：5.84
地址总线宽度：15边界扫描：YES
最大时钟频率：38.4 MHz外部数据总线宽度：32
格式：FLOATING POINT集成缓存：YES
JESD-30 代码：S-PBGA-B423长度：16 mm
低功率模式：YES端子数量：423
封装主体材料：PLASTIC/EPOXY封装代码：LFBGA
封装形状：SQUARE封装形式：GRID ARRAY, LOW PROFILE, FINE PITCH
认证状态：Not Qualified座面最大高度：1.4 mm
速度：800 MHz最大供电电压：1.33 V
最小供电电压：1.21 V标称供电电压：1.27 V
表面贴装：YES技术：CMOS
端子形式：BALL端子节距：0.65 mm
端子位置：BOTTOM宽度：16 mm
uPs/uCs/外围集成电路类型：MICROPROCESSORBase Number Matches：1

XDM3730ACBP 数据手册

 浏览型号XDM3730ACBP的Datasheet PDF文件第2页浏览型号XDM3730ACBP的Datasheet PDF文件第3页浏览型号XDM3730ACBP的Datasheet PDF文件第4页浏览型号XDM3730ACBP的Datasheet PDF文件第5页浏览型号XDM3730ACBP的Datasheet PDF文件第6页浏览型号XDM3730ACBP的Datasheet PDF文件第7页 
DM3730, DM3725  
www.ti.com  
SPRS685D–AUGUST 2010–REVISED JULY 2011  
DM3730, DM3725  
Digital Media Processors  
Check for Samples: DM3730, DM3725  
1 DM3730, DM3725 Digital Media Processors  
1.1 Features  
123456  
•
Load-Store Architecture With  
Non-Aligned Support  
64 32-Bit General-Purpose Registers  
Instruction Packing Reduces Code Size  
All Instructions Conditional  
Additional C64x+TM Enhancements  
• DM3730/25 Digital Media Processors:  
– Compatible with OMAP™ 3 Architecture  
– ARM® Microprocessor (MPU) Subsystem  
•
•
•
•
•
Up to 1-GHz ARM® Cortex™-A8 Core  
Also supports 300, 600, and 800-MHz  
operation  
•
NEON™ SIMD Coprocessor  
–
–
Protected Mode Operation  
Expectations Support for Error  
Detection and Program Redirection  
Hardware Support for Modulo Loop  
Operation  
– High Performance Image, Video, Audio  
(IVA2.2TM) Accelerator Subsystem  
•
Up to 800-MHz TMS320C64x+TM DSP Core  
Also supports 260, 520, and 660-MHz  
operation  
–
– C64x+TM L1/L2 Memory Architecture  
•
•
Enhanced Direct Memory Access (EDMA)  
Controller (128 Independent Channels)  
Video Hardware Accelerators  
•
•
•
•
32K-Byte L1P Program RAM/Cache  
(Direct Mapped)  
80K-Byte L1D Data RAM/Cache (2-Way  
Set- Associative)  
64K-Byte L2 Unified Mapped RAM/Cache  
(4- Way Set-Associative)  
32K-Byte L2 Shared SRAM and 16K-Byte  
L2 ROM  
– POWERVR SGX™ Graphics Accelerator  
(DM3730 only)  
•
•
Tile Based Architecture Delivering up to  
20 MPoly/sec  
Universal Scalable Shader Engine:  
Multi-threaded Engine Incorporating Pixel  
and Vertex Shader Functionality  
Industry Standard API Support:  
OpenGLES 1.1 and 2.0, OpenVG1.0  
Fine Grained Task Switching, Load  
Balancing, and Power Management  
Programmable High Quality Image  
Anti-Aliasing  
– C64x+TM Instruction Set Features  
•
•
•
•
•
•
Byte-Addressable (8-/16-/32-/64-Bit Data)  
8-Bit Overflow Protection  
Bit-Field Extract, Set, Clear  
Normalization, Saturation, Bit-Counting  
Compact 16-Bit Instructions  
Additional Instructions to Support  
Complex Multiplies  
•
•
•
– Advanced Very-Long-Instruction-Word  
(VLIW) TMS320C64x+TM DSP Core  
– External Memory Interfaces:  
•
SDRAM Controller (SDRC)  
•
•
Eight Highly Independent Functional  
Units  
Six ALUs (32-/40-Bit); Each Supports  
Single 32- bit, Dual 16-bit, or Quad 8-bit,  
Arithmetic per Clock Cycle  
Two Multipliers Support Four 16 x 16-Bit  
Multiplies (32-Bit Results) per Clock  
Cycle or Eight 8 x 8-Bit Multiplies (16-Bit  
Results) per Clock Cycle  
–
16, 32-bit Memory Controller With  
1G-Byte Total Address Space  
–
–
Interfaces to Low-Power SDRAM  
SDRAM Memory Scheduler (SMS) and  
Rotation Engine  
•
•
General Purpose Memory Controller  
(GPMC)  
–
16-bit Wide Multiplexed Address/Data  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
4
5
6
POWERVR SGX is a trademark of Imagination Technologies Ltd.  
OMAP is a trademark of Texas Instruments.  
Cortex, NEON are trademarks of ARM Limited.  
ARM is a registered trademark of ARM Ltd.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2010–2011, Texas Instruments Incorporated  
 
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