→
11
Virtex-6 Family Overview
DS150 (v2.4) January 19, 2012
Product Specification
General Description
The Virtex®-6 family provides the newest, most advanced features in the FPGA market. Virtex-6 FPGAs are the programmable silicon
foundation for Targeted Design Platforms that deliver integrated software and hardware components to enable designers to focus on
innovation as soon as their development cycle begins. Using the third-generation ASMBL™ (Advanced Silicon Modular Block) column-
based architecture, the Virtex-6 family contains multiple distinct sub-families. This overview covers the devices in the LXT, SXT, and HXT
sub-families. Each sub-family contains a different ratio of features to most efficiently address the needs of a wide variety of advanced logic
designs. In addition to the high-performance logic fabric, Virtex-6 FPGAs contain many built-in system-level blocks. These features allow
logic designers to build the highest levels of performance and functionality into their FPGA-based systems. Built on a 40 nm state-of-the-
art copper process technology, Virtex-6 FPGAs are a programmable alternative to custom ASIC technology. Virtex-6 FPGAs offer the best
solution for addressing the needs of high-performance logic designers, high-performance DSP designers, and high-performance
embedded systems designers with unprecedented logic, DSP, connectivity, and soft microprocessor capabilities.
Summary of Virtex-6 FPGA Features
•
Three sub-families:
•
Advanced DSP48E1 slices
•
•
•
Virtex-6 LXT FPGAs: High-performance logic with
advanced serial connectivity
Virtex-6 SXT FPGAs: Highest signal processing
capability with advanced serial connectivity
Virtex-6 HXT FPGAs: Highest bandwidth serial
connectivity
•
•
•
25 x 18, two's complement multiplier/accumulator
Optional pipelining
New optional pre-adder to assist filtering
applications
Optional bitwise logic functionality
Dedicated cascade connections
•
•
•
•
Compatibility across sub-families
•
Flexible configuration options
•
LXT and SXT devices are footprint compatible in
the same package
•
•
SPI and Parallel Flash interface
Multi-bitstream support with dedicated fallback
reconfiguration logic
Advanced, high-performance FPGA Logic
•
•
•
Real 6-input look-up table (LUT) technology
Dual LUT5 (5-input LUT) option
LUT/dual flip-flop pair for applications requiring rich
register mix
Improved routing efficiency
64-bit (or two 32-bit) distributed LUT RAM option
per 6-input LUT
•
Automatic bus width detection
•
•
System Monitor capability on all devices
•
On-chip/off-chip thermal and supply voltage
monitoring
JTAG access to all monitored quantities
•
•
•
Integrated interface blocks for PCI Express® designs
•
Compliant to the PCI Express Base Specification
2.0
Gen1 (2.5 Gb/s) and Gen2 (5 Gb/s) support with
GTX transceivers
Endpoint and Root Port capable
x1, x2, x4, or x8 lane support per block
•
SRL32/dual SRL16 with registered outputs option
•
•
Powerful mixed-mode clock managers (MMCM)
•
•
MMCM blocks provide zero-delay buffering,
frequency synthesis, clock-phase shifting, input-
jitter filtering, and phase-matched clock division
•
•
36-Kb block RAM/FIFOs
•
•
•
GTX transceivers: up to 6.6 Gb/s
•
Dual-port RAM blocks
Programmable
Data rates below 480 Mb/s supported by
oversampling in FPGA logic.
-
-
Dual-port widths up to 36 bits
Simple dual-port widths up to 72 bits
•
•
GTH transceivers: 2.488 Gb/s to beyond 11 Gb/s
Integrated 10/100/1000 Mb/s Ethernet MAC block
•
•
•
40 nm copper CMOS process technology
1.0V core voltage (-1, -2, -3 speed grades only)
Lower-power 0.9V core voltage option (-1L speed
grade only)
High signal-integrity flip-chip packaging available in
standard or Pb-free package options
•
•
•
Enhanced programmable FIFO logic
Built-in optional error-correction circuitry
Optionally use each block as two independent
18 Kb blocks
Supports 1000BASE-X PCS/PMA and SGMII
using GTX transceivers
Supports MII, GMII, and RGMII using SelectIO
technology resources
•
High-performance parallel SelectIO™ technology
•
•
1.2 to 2.5V I/O operation
2500Mb/s support available
Source-synchronous interfacing using
ChipSync™ technology
•
•
•
•
Digitally controlled impedance (DCI) active
termination
•
•
Flexible fine-grained I/O banking
High-speed memory interface support with
integrated write-leveling capability
•
© 2009–2012 Xilinx, Inc. Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Zynq, and other designated brands included herein are trademarks of Xilinx in the United States
and other countries.. PCI, PCIe and PCI Express are trademarks of PCI-SIG and used under license. All other trademarks are the property of their respective owners.
DS150 (v2.4) January 19, 2012
www.xilinx.com
Product Specification
1