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XBHAWT-00-0000-000LT30E4 PDF预览

XBHAWT-00-0000-000LT30E4

更新时间: 2024-11-25 00:31:19
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科锐 - CREE /
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描述
XLamp XB-H LEDs

XBHAWT-00-0000-000LT30E4 数据手册

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Product family data sheet  
Cree® XLamp® XB-H LEDs  
PꢀoDuCt DEꢁCꢀiPtion  
FEAtuꢀEꢁ  
tABLE oF ContEntꢁ  
Thꢀ XLamp® XB-H LeD dꢀliꢁꢀrs  
a
Available in white, outdoor white  
and 80‑, 85‑ and 90‑CRI white  
ANSI‑compatible chromaticity bins  
Binned at 85 °C  
Charactꢀristics........................................2  
Flux Charactꢀristics ................................3  
Relative Spectral Power Distribution .....4  
Relative Flux vs. Junction  
brꢀakthrough combination of lumꢀn  
output and efficacy in a small package.  
Dꢀliꢁꢀring morꢀ than 500 lumꢀns at  
1.5 A, 25 °C in a 2.45 mm2 package, the  
Crꢀꢀ XB-H LeD offꢀrs triplꢀ thꢀ lumꢀn  
density of competing high‑power LEDs  
to significantly increase the performance  
of today’s lighting designs. The XB‑H LED  
joins a new generation of directionally  
optimized LEDs that offers the industry’s  
highest optical control factor (OCF),  
a measurement of how LED size and  
performance benefit directional lighting  
applications. High‑OCF LEDs enable  
lighting manufacturꢀrs to improꢁꢀ thꢀ  
performance of any lighting design, create  
smaller and less expensive systems, and  
develop new lighting solutions that were  
previously not possible.  
Maximum drive current: 1500 mA  
Low thermal resistance: 4 °C/W  
Wide viewing angle: 110°  
Unlimited floor life at  
Tꢀmpꢀraturꢀ ...........................................4  
elꢀctrical Charactꢀristics........................5  
Relative Flux vs. Current .........................5  
Relative Chromaticity vs Current and  
Tꢀmpꢀratur............................................6  
Typical Spatial Distribution.....................7  
Thꢀrmal Dꢀsign.......................................7  
Reflow Soldering Characteristics...........8  
Notes .......................................................9  
Mꢀchanical Dimꢀnsions .......................11  
Tapꢀ and Rꢀꢀl........................................12  
Packaging..............................................13  
≤ 30 ºC/85% RH  
Reflow solderable ‑ JEDEC  
J‑STD‑020C  
Electrically neutral thermal path  
RoHS and REACh compliant  
UL® rꢀcognizꢀd componꢀnt  
(E349212)  
Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are  
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.  
Cree, Inc.  
4600 Silicon Drive  
Durham, NC 27703  
USA Tel: +1.919.313.5300