Datasheet > XBHAWT-00-0000-000LT50E1

XBHAWT-00-0000-000LT50E1

更新时间： 2022-12-29 20:38:57

品牌	Logo	应用领域
科锐 - CREE		/
页数	文件大小	规格书
13页	1368K
描述
XLamp XB-H LEDs

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Product family data sheet

Cree^®XLamp^®XB-H LEDs

PꢀoDuCt DEꢁCꢀiPtion

FEAtuꢀEꢁ

tABLE oF ContEntꢁ

Thꢀ XLamp^®XB-H LeD dꢀliꢁꢀrs

•

Available in white, outdoor white

and 80‑, 85‑ and 90‑CRI white

ANSI‑compatible chromaticity bins

Binned at 85 °C

Charactꢀristics........................................2

Flux Charactꢀristics ................................3

Relative Spectral Power Distribution .....4

Relative Flux vs. Junction

brꢀakthrough combination of lumꢀn

output and efﬁcacy in a small package.

Dꢀliꢁꢀring morꢀ than 500 lumꢀns at

1.5 A, 25 °C in a 2.45 mm²package, the

Crꢀꢀ XB-H LeD offꢀrs triplꢀ thꢀ lumꢀn

density of competing high‑power LEDs

to signiﬁcantly increase the performance

of today’s lighting designs. The XB‑H LED

joins a new generation of directionally

optimized LEDs that offers the industry’s

highest optical control factor (OCF),

a measurement of how LED size and

performance beneﬁt directional lighting

applications. High‑OCF LEDs enable

lighting manufacturꢀrs to improꢁꢀ thꢀ

performance of any lighting design, create

smaller and less expensive systems, and

develop new lighting solutions that were

previously not possible.

•

Maximum drive current: 1500 mA

Low thermal resistance: 4 °C/W

Wide viewing angle: 110°

Unlimited ﬂoor life at

Tꢀmpꢀraturꢀ ...........................................4

elꢀctrical Charactꢀristics........................5

Relative Flux vs. Current .........................5

Relative Chromaticity vs Current and

Tꢀmpꢀraturꢀ............................................6

Typical Spatial Distribution.....................7

Thꢀrmal Dꢀsign.......................................7

Reﬂow Soldering Characteristics...........8

Notes .......................................................9

Mꢀchanical Dimꢀnsions .......................11

Tapꢀ and Rꢀꢀl........................................12

Packaging..............................................13

≤ 30 ºC/85% RH

•

Reﬂow solderable ‑ JEDEC

J‑STD‑020C

•

Electrically neutral thermal path

RoHS and REACh compliant

UL^®rꢀcognizꢀd componꢀnt

(E349212)

registered trademarks and the Cree logo is a trademark of Cree, Inc. UL^®and the UR logo are registered trademarks of UL LLC.

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

12 3 4 5 6 7...13

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