Datasheet > WS512K32NV-85HI

WS512K32NV-85HI

更新时间： 2023-02-26 14:08:12

品牌	Logo	应用领域
美高森美 - MICROSEMI		静态存储器
页数	文件大小	规格书
9页	959K
描述
SRAM Module, 512KX32, 85ns, CMOS, CPGA66, 1.185 X 1.185 INCH, CERAMIC, HIP-66

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WS512K32NV-85HI 数据手册

WS512K32V-XXX

ADVANCED

PACKAGE 509: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2T)

4.57 (0.180) MAX

22.36 (0.880) 0.26 (0.010) Sꢀ

0.27 (0.011) 0.04 (0.002)

Pin 1

0.25 (0.010) REF

R 0.25

(0.010)

24.03 (0.946)

0.26 (0.010)

0.19 (0.00

0.06 (0.0

1° / 7°

1.0 (0.040)

0.127 (0.005)

23.87

(0.940) REF

DETAIL A

50)

SEE DETAIL "A"

0.38 (0.015) 0.05 (0.002)

20.3 (0.800) REF

The WEDC 68 lead G2T CQFP ﬁlls the same

ﬁt and function as the JEDEC 68 lead CQFJ

or 68 PLCC. But the G2T has the TCE and

lead inspection advantage of the CQFP form.

0 940"

ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

Microsemi Corporation reserves the right to change products or speciﬁcations without notice.

Rev. 3

Microsemi Corporation • (602) 437-1520 • www.microsemi.com

1...4 5 678 9

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型号	品牌	描述	获取价格	数据表
WS512K32NV-85HMA	MICROSEMI	SRAM Module, 512KX32, 85ns, CMOS, CPGA66, 1.185 X 1.185 INCH, CERAMIC, HIP-66	获取价格
WS512K32NV-85HQ	WEDC	Standard SRAM, 512KX32, 85ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC,	获取价格
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