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WS512K32V-120HM PDF预览

WS512K32V-120HM

更新时间: 2024-02-04 17:06:16
品牌 Logo 应用领域
美高森美 - MICROSEMI 静态存储器内存集成电路
页数 文件大小 规格书
8页 319K
描述
Standard SRAM, 512KX32, 120ns, CMOS, CPGA66, 1.185 X 1.185 INCH, CERAMIC, HIP-66

WS512K32V-120HM 技术参数

生命周期:Obsolete包装说明:1.185 X 1.185 INCH, CERAMIC, HIP-66
Reach Compliance Code:unknown风险等级:5.55
最长访问时间:120 nsJESD-30 代码:S-CPGA-P66
长度:30.1 mm内存密度:16777216 bit
内存集成电路类型:STANDARD SRAM内存宽度:32
功能数量:1端子数量:66
字数:524288 words字数代码:512000
工作模式:ASYNCHRONOUS最高工作温度:125 °C
最低工作温度:-55 °C组织:512KX32
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:PGA
封装形状:SQUARE封装形式:GRID ARRAY
并行/串行:PARALLEL认证状态:Not Qualified
座面最大高度:6.22 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:NO技术:CMOS
温度等级:MILITARY端子形式:PIN/PEG
端子节距:2.54 mm端子位置:PERPENDICULAR
宽度:30.1 mmBase Number Matches:1

WS512K32V-120HM 数据手册

 浏览型号WS512K32V-120HM的Datasheet PDF文件第2页浏览型号WS512K32V-120HM的Datasheet PDF文件第3页浏览型号WS512K32V-120HM的Datasheet PDF文件第4页浏览型号WS512K32V-120HM的Datasheet PDF文件第5页浏览型号WS512K32V-120HM的Datasheet PDF文件第6页浏览型号WS512K32V-120HM的Datasheet PDF文件第7页 
WS512K32V-XXX  
White Electronic Designs  
ADVANCED*  
512Kx32 SRAM 3.3V MODULE  
FEATURES  
Access Times of 70, 85, 100, 120ns  
Packaging  
TTL Compatible Inputs and Outputs  
Low Voltage Operation:  
• 3.3V 10% Power Supply  
Low Power CMOS  
• 66-pin, PGA Type, 1.185 inch square, Hermetic  
Ceramic HIP (Package 401)  
• 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880  
inch), 4.57mm (0.180") high (Package 510).  
Designed to fit JEDEC 68 lead 0.990" CQFJ  
footprint  
Built-in Decoupling Caps and Multiple Ground Pins  
for Low Noise Operation  
Weight  
WS512K32V-XG2TX - 8 grams typical  
WS512K32V-XHX - 13 grams typical  
Organized as 512Kx32; User Configurable as  
1024Kx16 or 2Mx8  
Commercial, Industrial and Military Temperature  
Ranges  
* This product is under development, is not qualified or characterized and is subject to  
change or cancellation without notice.  
PIN CONFIGURATION FOR WS512K32NV-XHX  
Top View  
Pin Description  
1
12  
23  
34  
45  
56  
I/O0-31  
A0-18  
Data Inputs/Outputs  
Address Inputs  
Write Enables  
Chip Selects  
Output Enable  
Power Supply  
Ground  
I/O8  
I/O9  
I/O10  
A13  
WE2#  
CS2#  
GND  
I/O11  
A10  
I/O15  
I/O24  
I/O25  
I/O26  
A6  
VCC  
CS4#  
WE4#  
I/O27  
A3  
I/O31  
I/O30  
I/O29  
I/O28  
A0  
WE1-4  
#
I/O14  
I/O13  
I/O12  
OE#  
A18  
CS1-4  
OE#  
VCC  
#
GND  
NC  
Not Connected  
A14  
A7  
A15  
A11  
NC  
A4  
A1  
Block Diagram  
A16  
A12  
WE1#  
I/O7  
A8  
A5  
A2  
WE1# CS1#  
WE2# CS2#  
WE3# CS3#  
WE4# CS4#  
OE#  
A0-18  
A17  
VCC  
A9  
WE3#  
CS3#  
GND  
I/O19  
I/O23  
I/O22  
I/O21  
I/O20  
I/O0  
I/O1  
I/O2  
CS1#  
NC  
I/O6  
I/O16  
I/O17  
I/O18  
512K x 8  
512K x 8  
512K x 8  
512K x 8  
I/O5  
8
8
8
8
I/O3  
I/O4  
I/O0-7  
I/O8-15  
I/O16-23  
I/O24-31  
11  
22  
33  
44  
55  
66  
February 2000  
Rev. 2  
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com  

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