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WF2M32-90G2UM5A PDF预览

WF2M32-90G2UM5A

更新时间: 2024-02-06 12:55:05
品牌 Logo 应用领域
WEDC 内存集成电路
页数 文件大小 规格书
15页 634K
描述
Flash Module, 2MX32, 90ns, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

WF2M32-90G2UM5A 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68Reach Compliance Code:unknown
风险等级:5.73最长访问时间:90 ns
其他特性:CAN BE CONFIGURED AS 8M X 8备用内存宽度:16
数据轮询:YESJESD-30 代码:S-CQFP-G68
JESD-609代码:e0长度:22.36 mm
内存密度:67108864 bit内存集成电路类型:FLASH MODULE
内存宽度:32功能数量:1
部门数/规模:32端子数量:68
字数:2097152 words字数代码:2000000
工作模式:ASYNCHRONOUS最高工作温度:125 °C
最低工作温度:-55 °C组织:2MX32
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:QFP
封装等效代码:QFP68,.99SQ,50封装形状:SQUARE
封装形式:FLATPACK并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
编程电压:5 V认证状态:Not Qualified
座面最大高度:3.51 mm部门规模:64K
最大待机电流:0.008 A子类别:Flash Memories
最大压摆率:0.24 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:TIN LEAD
端子形式:GULL WING端子节距:1.27 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
切换位:YES类型:NOR TYPE
宽度:22.36 mmBase Number Matches:1

WF2M32-90G2UM5A 数据手册

 浏览型号WF2M32-90G2UM5A的Datasheet PDF文件第2页浏览型号WF2M32-90G2UM5A的Datasheet PDF文件第3页浏览型号WF2M32-90G2UM5A的Datasheet PDF文件第4页浏览型号WF2M32-90G2UM5A的Datasheet PDF文件第5页浏览型号WF2M32-90G2UM5A的Datasheet PDF文件第6页浏览型号WF2M32-90G2UM5A的Datasheet PDF文件第7页 
WF2M32-XXX5  
White Electronic Designs  
2Mx32 5V Flash Module  
FEATURES  
„
Access Time of 90, 120, 150ns  
„
„
Organized as 2Mx32  
„
Packaging:  
Commercial, Industrial, and Military  
Temperature Ranges  
• 66 pin, PGA Type, 1.185" square, Hermetic  
Ceramic HIP (Package 401).  
„
„
„
5 Volt Read and Write. 5V ± 10% Supply.  
Low Power CMOS  
• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880")  
square (Package 510) 3.56mm (0.140") height.  
Designed to t JEDEC 68 lead 0.990" CQFJ  
footprint (FIGURE 3)  
Data# Polling and Toggle Bit feature for detection of  
program or erase cycle completion.  
„
„
„
Supports reading or programming data to a sector  
not being erased.  
„
„
Sector Architecture  
RESET# pin resets internal state machine to the  
read mode.  
• 32 equal size sectors of 64KBytes per each 2Mx8  
chip  
Built in Decoupling Caps and Multiple Ground Pins  
for Low Noise Operation, Separate Power and  
Ground Planes to improve noise immunity  
• Any combination of sectors can be erased. Also  
supports full chip erase.  
Minimum 100,000 Write/Erase Cycles Minimum  
* This product is subject to change without notice.  
Note: For programming information refer to Flash Programming 16M5 Application Note.  
FIGURE 1 – PIN CONFIGURATION FOR WF2M32-XHX5  
Top View  
Pin Description  
I/O0-31  
A0-20  
WE1-4#  
CS1-4#  
OE#  
Data Inputs/Outputs  
Address Inputs  
Write Enables  
Chip Selects  
1
12  
23  
34  
45  
56  
I/O8  
I/O9  
I/O10  
A14  
A16  
A11  
A0  
WE2#  
CS2#  
GND  
I/O11  
A10  
I/O15  
I/O24  
I/O25  
I/O26  
A7  
VCC  
CS4#  
WE4#  
I/O27  
A4  
I/O31  
I/O30  
I/O29  
I/O28  
A1  
I/O14  
I/O13  
I/O12  
OE#  
A17  
Output Enable  
Power Supply  
Ground  
VCC  
GND  
A12  
Block Diagram  
WE1# CS1#  
WE2# CS2#  
WE3# CS3#  
WE4# CS4#  
2M x 8  
A9  
A20  
A5  
A2  
OE#  
A0-20  
A15  
WE1#  
I/O7  
A13  
A6  
A3  
2M x 8  
2M x 8  
2M x 8  
A18  
I/O0  
I/O1  
I/O2  
VCC  
CS1#  
A19  
A8  
WE3#  
CS3#  
GND  
I/O19  
I/O23  
I/O22  
I/O21  
I/O20  
I/O6  
I/O16  
I/O17  
I/O18  
8
8
8
8
I/O5  
I/O16-23  
I/O24-31  
I/O0-7  
I/O8-15  
I/O3  
I/O4  
RESET# internally tied to VCC in the HIP package for this pin con-  
guration. See Alternate Pin Conguration with RESET# tied to pin  
12 for system control of reset (FIGURE 10, page 11).  
11  
22  
33  
44  
55  
66  
October 2004  
Rev. 5  
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  

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