Datasheet > WF1M32B-XG2TX3

WF1M32B-XG2TX3

更新时间： 2024-02-17 14:39:40

品牌	Logo	应用领域
其他 - ETC		闪存
页数	文件大小	规格书
13页	163K
描述
Flash MCP

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中文翻译

获取价格

数据手册

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WF1M32B-XG2TX3 数据手册

WF1M32B-XXX3

HI-RELIABILITY PRODUCT

1Mx32 3.3V FLASH MODULE

FEATURES

■ Access Times of 100, 120, 150ns

■ Boot Code Sector Architecture (Bottom)

■ Packaging

■ Low Power CMOS, 1.0mA Standby

• 66 pin, PGA Type, 1.185" square, Hermetic Ceramic

HIP (Package 401)

■ Embedded Erase and Program Algorithms

■ Built-in Decoupling Caps for Low Noise Operation

• 68 lead, Low Profile CQFP (G2T), 4.6mm (0.180")

square (Package 509)

■ Erase Suspend/Resume

• Supports reading data from or programing data to a

sector not being erased

■ 1,000,000 Erase/Program Cycles

■ Sector Architecture

■ Low Current Consumption

Typical values at 5MHz:

• One 16KByte, two 8KBytes, one 32KByte, and fifteen

64kBytes in byte mode

• 40mA Active Read Current

• 80mA Program/Erase Current

• Any combination of sectors can be concurrently erased.

Also supports full chip erase

■ Weight

WF1M32B-XG2TX3 -8 grams typical

WF1M32B-XHX3 -13 grams typical

■ Organized as 1Mx32

■ Commercial, Industrial and Military Temperature Ranges

■ 3.3 Volt for Read and Write Operations

Note: For programming information refer to Flash Programming 8M3

Application Note.

PIN CONFIGURATION FOR WF1M32B-XHX3

TOP VIEW

PIN DESCRIPTION

I/O0-31 Data Inputs/Outputs

I/O8

I/O9

I/O10

A14

A16

A11

RESET

CS2

GND

I/O11

A10

I/O15

I/O14

I/O13

I/O12

I/O24

I/O25

I/O26

VCC

CS4

I/O31

I/O30

I/O29

I/O28

A0-19

Address Inputs

Write Enable

Chip Selects

Output Enable

Reset

CS1-4

I/O27

RESET

VCC

A12

Power Supply

A17

GND

Ground

Not Connected

A15

A13

A18

I/O0

I/O1

I/O2

VCC

CS1

A19

I/O7

I/O6

I/O5

I/O4

I/O23

I/O22

I/O21

I/O20

BLOCK DIAGRAM

I/O16

I/O17

I/O18

CS3

GND

I/O19

RESET

A0-19

I/O3

1M x 8

I/O16-23

I/O24-31

I/O0-7

I/O8-15

May 1999 Rev. 4

White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520

12 3 4 5 6 7...13

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