是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | CGA |
包装说明: | CGA, | 针数: | 255 |
Reach Compliance Code: | compliant | ECCN代码: | 3A001.A.2.C |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.81 |
Is Samacsys: | N | 其他特性: | IC ALSO REQUIRES PLL SUPPLY VOLTAGE OF 2.375V TO 2.625V AND I/O SUPPLY VOLTAGE OF 3.135V TO 3.465V |
地址总线宽度: | 32 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 233 MHz |
外部数据总线宽度: | 32 | 格式: | FLOATING POINT |
集成缓存: | NO | JESD-30 代码: | S-CBGA-X255 |
长度: | 21 mm | 低功率模式: | YES |
端子数量: | 255 | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | CGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | 座面最大高度: | 4.4 mm |
速度: | 233 MHz | 最大供电电压: | 2.625 V |
最小供电电压: | 2.375 V | 标称供电电压: | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | MILITARY | 端子形式: | UNSPECIFIED |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 21 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
WEDMC64603RV233CM | ETC |
获取价格 |
Microprocessor | |
WEDMC64603RV266BI | ETC |
获取价格 |
Microprocessor | |
WEDMC64603RV266BM | ETC |
获取价格 |
Microprocessor | |
WEDMC64603RV266CI | ETC |
获取价格 |
Microprocessor | |
WEDMC64603RV266CM | ETC |
获取价格 |
Microprocessor | |
WEDMC64603RV300BI | MICROSEMI |
获取价格 |
RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, 3 MM HEIGHT | |
WEDMC64603RV300BM | ETC |
获取价格 |
Microprocessor | |
WEDMC64603RV300CI | ETC |
获取价格 |
Microprocessor | |
WEDMC64603RV300CM | MICROSEMI |
获取价格 |
RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, CG | |
WEDPDC3225-B | WEDC |
获取价格 |
25X32MM Daisy-Chain PBGA |