WED8LM32513C
HI-RELIABILITY PRODUCT
512Kx32 SRAM MODULE
PRELIMINARY*
FEATURES
■ Access Times of 15**, 17, 20, 25, 35, 45, 55ns
■ Low Power CMOS
■ Built-in Decoupling Caps and Multiple Ground Pins for Low
■ Packaging
Noise Operation
• 68 lead, 23.88mm Low Profile CQFP, 3.56mm (0.140")
■ Organized as 512Kx32, User Configurable as 1Mx16 or 2Mx8
■ Commercial, Industrial and Military Temperature Ranges
■ TTL Compatible Inputs and Outputs
* This data sheet describes a product under development, not fully
characterized, and is subject to change without notice.
** 15ns Access Time available only in Commercial and Industrial Temperature.
This speed is not fully characterized and is subject to change without notice.
■ 5 Volt Power Supply
FIG. 1 PIN CONFIGURATION FOR WED8LM32513C-E
TOP VIEW
PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs
9
8
7
6
5
4
3
2
1
68 67 66 65 64 63 62 61
60
A0-18
WE1-4
CS1-4
OE
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
0
1
2
3
4
5
6
7
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
GND
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O30
I/O31
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
0.940"
VCC
The WEDC 68 lead CQFP fills the
same fit and function as the
JEDEC 68 lead CQFJ or 68 PLCC.
But the CQFP has the TCE and
lead inspection advantage of the
CQFP form.
GND
NC
GND
Not Connected
I/O
I/O
8
9
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
BLOCK DIAGRAM
WE3 CS3
WE4 CS4
WE1 CS1
WE2 CS2
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
OE
A0-18
512K x 8
512K x 8
512K x 8
512K x 8
8
8
8
8
I/O16-23
I/O24-31
I/O0-7
I/O8-15
July 1999 Rev. 0
1
White Electronic Designs Corporation • (602) 437-1520 • www.whitedc.com