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WDBR1

更新时间： 2024-11-18 05:55:15
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TTELEC /
页数 文件大小 规格书
3页 741K
描述
Ultra low profile thick-film on steel

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WDBR1 技术参数

是否Rohs认证： 符合生命周期：Active
包装说明：,Reach Compliance Code：compliant
风险等级：5.61其他特性：FLAME PROOF
JESD-609代码：e2安装特点：CHASSIS MOUNT; SURFACE MOUNT
端子数量：2最高工作温度：200 °C
最低工作温度：-55 °C封装形状：RECTANGULAR PACKAGE
包装方法：BULK额定功率耗散 (P)：180 W
电阻器类型：FIXED RESISTOR表面贴装：NO
技术：METAL GLAZE/THICK FILM端子面层：Tin/Silver (Sn96Ag4)
端子形状：FLEXIBLE WIRE; LUG; ONE SURFACEBase Number Matches：1

WDBR1 数据手册

 浏览型号WDBR1的Datasheet PDF文件第2页浏览型号WDBR1的Datasheet PDF文件第3页 
Ultra Low Profile  
Power Resistors  
WDBR Series  
·
·
·
·
·
·
·
·
Ultra low profile thick-film on steel  
500W to 7kW peak power  
Single fixing heatsink mountable  
Ideal for dynamic braking, inrush limit and snubber circuits  
Choice of flying lead, push-on or solder terminations  
Low inductance design  
High isolation, even after failsafe overload fusing  
RoHS compliant, non-flammable construction  
Electrical Data  
WDBR1/2  
ohms 22, 47, 100  
%
WDBR1 WDBR2 WDBR3 WDBR5  
WDBR7  
47, 100, 150  
Resistance range  
12, 22, 47, 100, 150  
10  
Resistance tolerance  
Pulse power rating 1  
Power rating on heatsink 2  
kW  
0.5  
1.5  
180  
700  
2.0  
200  
780  
3.5  
260  
900  
5.0  
270  
1000  
7.0  
W
280 4  
1490 4  
160  
Power rating on fan-cooled heatsink 3  
W
300  
TCR  
ppm/°C  
°C  
V (dc/ac peak)  
+500 to +600  
Maximum element temperature  
Dielectric withstand  
Inductance (typical)  
Notes:  
365  
2500  
<4  
μH  
<3  
<5  
<6  
1. For details of pulse condition see Fig. 1 in Performance Data.  
2. Mounted on a 0.53°C/W heatsink with no forced air cooling, air temperature 25°C.  
3. Mounted on a 0.53°C/W heatsink with 5m/s forced air cooling, air temperature 25°C.  
4. Limited by the solder type; the rating can be improved for non-standard parts by using HMP solder.  
Physical Data  
Dimensions in mm, weight without terminations in g  
D
c
a
L ±0.1 W ±0.1 t ±0.1 ØD nom a nom b nom c nom Wt. nom  
WDBR1/2  
31.9  
28.1  
2.2  
3.2  
7.5  
3.1  
4.3  
6.5  
b
W
WDBR1  
WDBR2  
WDBR3  
WDBR5  
WDBR7  
49.3  
61  
35.9  
40.6  
70  
3.2  
4.7  
11.2  
13.0  
22.0  
23.8  
51.3  
6.2  
5.8  
12.6  
17.1  
50.8  
60.7  
181.8  
0.9  
101.6  
122  
13.5  
14.0  
15.0  
10.2  
7.4  
L
5.3  
70  
Substrate thickness = t  
Fixing hole is located centrally  
152.4 101.6 1.5  
9.2  
Construction  
A high integrity dielectric layer is applied to a machined  
stainless steel substrate. Thick-film conductor and resistor  
patterns are printed and fired, then protected with a high  
temperature overglaze. The termination pads are tinned with  
Pb-free solder and optional terminals or leads are soldered on.  
General Note  
Welwyn Components reserves the right to make changes in product specification without notice or liability.  
All information is subject to Welwyn’s own test data and is considered accurate at time of print.  
Ó We lwyn Compone nts Limite d  
Welwyn Electronics Park, Bedlington, Northumberland, NE22 7AA, England. Tel: 01670 822181 Fax: 01670 829465 Web: www.welwyn-tt.com  
123

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