Ultra Low Profile Power Resistors
WDBR Series
Features:
•
•
•
•
•
•
•
•
Ultra low profile thick-film on steel
500W to 7kW peak power
Single fixing heatsink mountable
Ideal for dynamic braking, inrush limit and snubber circuits
Choice of flying leads, push-on tags or solder terminaꢀons
Low inductance design
High isolaꢀon, even aꢂer failsafe overload fusing
Non-flammable construcꢀon
All Pb-free parts comply with EU Direcꢀve 2011/65/EU amended by (EU) 2015/863 (RoHS3)
Electrical Data
WDBR1/2
WDBR1
WDBR2
WDBR3
WDBR5
WDBR7
Resistance range
Ω
2R2 - 150R 3R3 - 270R 8R2 – 820R 8R2 – 1K0
10R – 1K5
10R – 1K0
Standard values
E12 preferred. 20R, 25R and 50R are also available.
10
Resistance tolerance
Pulse peak power rating1
Power rating on heatsink2
Power rating on fan cooled heatsink3
TCR
%
kW
0.5
160
300
1
2
3
5
7
W
180
700
200
780
260
900
270
1000
280
1490
W
ppm/°C
<+600
450
Maximum element temperature
Ambient temperature range (heatsink)
Dielectric withstand4
Inductance
°C
°C
V (dc/ac pk)
µH
-55 to +200
2500
<3
<4
<5
<6
Notes:
1. For details of pulse condiꢀon see Fig. 1 in Performance Data.
2. Mounted on a 0.53°C/W heatsink with no forced air cooling, air temperature 25°C.
3. Mounted on a 0.53°C/W heatsink with 5m/s forced air cooling, air temperature 25°C.
4. Based on 100% producꢀon test, duraꢀon 2s minimum.
Physical Data
Dimensions in mm and weight without terminations in g
t = substrate
thickness
L
W
±0.1
t
ØD
a
nom
b
nom
c
nom
d
min
Wt.
nom
Type
±0.1
±0.1 nom
WDBR1/2 31.9
28.1
35.9
40.6 0.9
70
70
2.2
3.2
7.5
3.2
4.7
13.5
14
3.1
11.2
13
22
23.8
51.3
4.3
6.2
5.8
10.2
7.4
9.2
1.4
1.9
3.8
7.2
6.1
7.9
6.5
d = clearance
between exposed
conductor and
exposed steel
substrate
WDBR1
WDBR2
49.3
61
12.6
17.1
50.8
60.7
181.8
WDBR3 101.6
WDBR5 122
WDBR7 152.4 101.6 1.5
5.3
15
Notes:
1. The fixing hole is located centrally except on WDBR1/2 where the dimension from the edge by the terminaꢀons to the mounꢀng hole centre is 16.7mm.
2. In addiꢀon to the central fixing hole, WDBR7 has two smaller corner holes. These are present for manufacturing purposes only and should not be used as fixing holes.
Construcꢀon
Construcꢀon Cross Secꢀon
A high integrity dielectric layer is applied to
a machined stainless-steel substrate. Thick-
film conductor and resistor paꢁerns are
printed and fired, then protected with a high
temperature overglaze. The terminaꢀon
pads are ꢀnned with solder and opꢀonal
terminals or leads are soldered on.
General Note
BI Technologies IRC Welwyn
TT Electronics reserves the right to make changes in product specificaꢀon without noꢀce or liability.
All informaꢀon is subject to TT Electronics’ own data and is considered accurate at ꢀme of going to print.
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05.23
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