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WCMA4016U1X

更新时间: 2022-11-24 21:50:47
品牌 Logo 应用领域
其他 - ETC /
页数 文件大小 规格书
9页 161K
描述
256K x 16 Static RAM

WCMA4016U1X 数据手册

 浏览型号WCMA4016U1X的Datasheet PDF文件第2页浏览型号WCMA4016U1X的Datasheet PDF文件第3页浏览型号WCMA4016U1X的Datasheet PDF文件第4页浏览型号WCMA4016U1X的Datasheet PDF文件第5页浏览型号WCMA4016U1X的Datasheet PDF文件第6页浏览型号WCMA4016U1X的Datasheet PDF文件第7页 
62147BV  
P relim inary  
WCMA4016U1X  
256K x 16 Static RAM  
both BHE and BLE are HIGH). The input/output pins (I/O0  
through I/O15) are placed in a high-impedance state when:  
deselected (CE1HIGH or CE2 LOW), outputs are disabled (OE  
HIGH), both Byte High Enable and Byte Low Enable are  
disabled (BHE, BLE HIGH), or during a write operation (CE1  
LOW, CE2 HIGH and WE LOW).  
Features  
• Low voltage range: 2.7V–3.6V  
• Ultra-low active, standby power  
• Easy memory expansion with CE1 and CE2 and OE fea-  
tures  
Writing to the device is accomplished by taking Chip Enables  
(CE1 LOW and CE2 HIGH) and Write Enable (WE) input LOW.  
If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0  
through I/O7), is written into the location specified on the  
address pins (A0 through A18). If Byte High Enable (BHE) is  
LOW, then data from I/O pins (I/O8 through I/O15) is written into  
the location specified on the address pins (A0 through A18).  
• TTL-compatible inputs and outputs  
• Automatic power-down when deselected  
• CMOS for optimum speed/power  
Functional Description[1]  
The WCMA4016U1X is a high-performance CMOS static  
RAM organized as 262,144 words by 16 bits. This device  
features advanced circuit design to provide ultra-low active  
current and standby current. This is ideal for providing more  
battery life in portable applications such as cellular telephones.  
The device also has an automatic power-down feature that  
significantly reduces power consumption by 99% when  
addresses are not toggling. The device can also be put into  
standby mode when deselected (CE1 HIGH or CE2 LOW or  
Reading from the device is accomplished by taking Chip  
Enables (CE1 LOW and CE2 HIGH) and Output Enable (OE)  
LOW while forcing the Write Enable (WE) HIGH. If Byte Low  
Enable (BLE) is LOW, then data from the memory location  
specified by the address pins will appear on I/O0 to I/O7. If Byte  
High Enable (BHE) is LOW, then data from memory will appear  
on I/O8 to I/O15. See the truth table at the back of this  
datasheet for a complete description of read and write modes.  
Logic Block Diagram  
Pin  
Configurations  
FBGA (Top View)  
1
2
4
3
5
6
A
A
A
2
CE  
OE  
BLE  
0
1
2
A
B
C
DATA IN DRIVERS  
A
A
4
I/O BHE  
8
CE  
I/O  
I/O  
0
3
A
9
A
A
8
7
6
A
A
6
I/O I/O  
I/O  
2
5
9
10  
1
A
A
A
A
V
V
I/O  
I/O  
3
A
5
4
3
2
CC  
D
E
F
SS  
7
256K × 16  
RAM Array  
2048 × 2048  
11  
17  
I/O – I/O  
0
7
A
A
V
CC  
NC  
V
SS  
I/O  
I/O  
16  
12  
4
I/O – I/O  
A
8
15  
A
A
1
0
A
A
15  
I/O  
I/O  
I/O  
I/O  
6
14  
13  
5
14  
A
A
G
H
I/O  
I/O  
NC  
WE  
13  
12  
15  
7
COLUMN DECODER  
A
A
9
A
A
NC  
NC  
10  
11  
8
BHE  
WE  
CE2  
CE1  
OE  
BLE  
Power -Down  
Circuit  
CE  
CE  
BHE  
BLE  
2
1
.
Weida Semiconductor, Inc.  

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