W55MID15
WINBOND MFIDWB TRANSPONDER
Table of Contents-
1.
2.
3.
4.
5.
GENERAL DESCRIPTION ......................................................................................................... 2
FEATURES................................................................................................................................. 2
PAD DESCRIPTION ................................................................................................................... 3
BLOCK DIAGRAM ...................................................................................................................... 3
FUNCTIONAL DESCRIPTION.................................................................................................... 4
5.1 External Inductor Coupling Circuit..................................................................................... 4
5.2 Voltage Regulator & System Power Supply ...................................................................... 4
5.3 Power-On Control Circuit................................................................................................... 4
5.4 Demodulation Control Circuit............................................................................................. 4
5.5 System Clock Generator.................................................................................................... 4
5.6 Bonding-ID Decoder .......................................................................................................... 4
5.7 Multiple Bonding-ID Arrays................................................................................................ 4
5.8 Data Format and Framing Generator................................................................................ 4
5.9 Modulation Control Circuit ................................................................................................. 4
6.
ELECTRICAL CHARACTERISTICS........................................................................................... 5
6.1 Absolute Maximum Ratings............................................................................................... 5
6.2 DC Characteristics............................................................................................................. 5
7.
8.
ORDERING INFORMATION....................................................................................................... 5
DESIGN INFORMATION ............................................................................................................ 6
8.1 Reference Design.............................................................................................................. 6
8.1.1
Demo Board....................................................................................................................... 6
TIPICAL APPLICATION CIRCUIT .............................................................................................. 6
REVISION HISTORY.................................................................................................................. 7
9.
10.
Publication Release Date: April 18, 2005
- 1 -
Revision A3
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