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W55RFS27T3BH PDF预览

W55RFS27T3BH

更新时间： 2024-12-01 03:17:35
品牌 Logo 应用领域
华邦 - WINBOND /
页数 文件大小 规格书
16页 330K
描述
SUPER-REGENERATION RF RECEIVER

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中文翻译

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W55RFS27T3BH 技术参数

生命周期：Transferred包装说明：, DIE OR CHIP
Reach Compliance Code：unknown风险等级：5.71
最高工作温度：70 °C最低工作温度：
封装等效代码：DIE OR CHIP电源：2.5/5 V
认证状态：Not Qualified子类别：Other Telecom ICs
最大压摆率：50 mA温度等级：COMMERCIAL
Base Number Matches：1

W55RFS27T3BH 数据手册

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W55RFS27T3B DATA SHEET  
SUPER-REGENERATION RF RECEIVER  
Table of Content-  
1.  
GENERAL DESCRIPTION ......................................................................................................... 2  
1.1 Features............................................................................................................................. 2  
1.2 W55RFS27T3B Pad Definition.......................................................................................... 3  
1.2.1  
1.2.2  
1.2.3  
1.2.4  
Pad Description ................................................................................................................3  
Clock Frequency Select (CKSEL) Setup ..........................................................................3  
ID Setup ...........................................................................................................................4  
Baseband Encoder Control Function Description.............................................................4  
2.  
3.  
SYSTEM DESCRIPTION............................................................................................................ 5  
2.1 W55RFS27T3B System Block Diagram............................................................................ 5  
2.2 W55RFS27T3B Functional Description............................................................................. 6  
ELECTRONIC CHARACTERISTICS.......................................................................................... 7  
3.1 W55RFS27T3B Absolute Maximum Ratings..................................................................... 7  
3.2 W55RFS27T3B DC Characteristics .................................................................................. 7  
3.3 W55RFS27T3B Ordering Information ............................................................................... 8  
3.4 W55RFS27T3B Package Information ............................................................................... 8  
3.4.1  
Bonding Pad List ..............................................................................................................8  
3.4.2  
Bonding Pad Diagram ......................................................................................................9  
4.  
5.  
DESIGN INFORMATION .......................................................................................................... 10  
4.1 W55RFS27T3B Reference Design.................................................................................. 10  
4.1.1  
4.1.2  
4.1.3  
TXOUT waveform...........................................................................................................10  
Application Circuit for 6 Control Functions......................................................................11  
Application Circuit for 4 Control Functions......................................................................12  
4.2 uC-Mode Control Signal .................................................................................................. 14  
4.3 W55RFS27T Family FCC Certification............................................................................ 15  
REVISION HISTORY................................................................................................................ 16  
Publication Release Date:June 8, 2005  
- 1 -  
Revision A1  
1234567...16

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