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W55MID35 PDF预览

W55MID35

更新时间: 2024-12-01 19:09:51
品牌 Logo 应用领域
华邦 - WINBOND 电信电信集成电路
页数 文件大小 规格书
7页 189K
描述
Telecom Circuit,

W55MID35 技术参数

生命周期:Transferred包装说明:, DIE OR CHIP
Reach Compliance Code:unknown风险等级:5.71
最高工作温度:70 °C最低工作温度:
封装等效代码:DIE OR CHIP电源:4.5 V
认证状态:Not Qualified子类别:Other Telecom ICs
标称供电电压:4.5 V电信集成电路类型:TELECOM CIRCUIT
温度等级:COMMERCIALBase Number Matches:1

W55MID35 数据手册

 浏览型号W55MID35的Datasheet PDF文件第2页浏览型号W55MID35的Datasheet PDF文件第3页浏览型号W55MID35的Datasheet PDF文件第4页浏览型号W55MID35的Datasheet PDF文件第5页浏览型号W55MID35的Datasheet PDF文件第6页浏览型号W55MID35的Datasheet PDF文件第7页 
W55MID35  
WINBOND MFIDWB TRANSPONDER  
Table of Contents-  
1.  
2.  
3.  
4.  
5.  
GENERAL DESCRIPTION ......................................................................................................... 2  
FEATURES................................................................................................................................. 2  
PAD DESCRIPTION ................................................................................................................... 3  
BLOCK DIAGRAM ...................................................................................................................... 3  
FUNCTIONAL DESCRIPTION.................................................................................................... 4  
5.1 External Inductor Coupling Circuit..................................................................................... 4  
5.2 Voltage Regulator & System Power Supply ...................................................................... 4  
5.3 Power-On Control Circuit................................................................................................... 4  
5.4 Demodulation Control Circuit............................................................................................. 4  
5.5 System Clock Generator.................................................................................................... 4  
5.6 Bonding-ID Decoder .......................................................................................................... 4  
5.7 Multiple Bonding-ID Recognition ....................................................................................... 4  
5.8 Data Format and Framing Generator................................................................................ 4  
5.9 Modulation Control Circuit ................................................................................................. 4  
6.  
ELECTRICAL CHARACTERISTICS........................................................................................... 5  
6.1 Absolute Maximum Ratings............................................................................................... 5  
6.2 DC Characteristics............................................................................................................. 5  
7.  
8.  
ORDERING INFORMATION....................................................................................................... 5  
DESIGN INFORMATION ............................................................................................................ 6  
8.1 W55MID35 Reference Design........................................................................................... 6  
8.1.1  
Demo Board....................................................................................................................... 6  
TIPICAL APPLICATION CIRCUIT .............................................................................................. 6  
REVISION HISTORY.................................................................................................................. 7  
9.  
10.  
Publication Release Date: April 19, 2005  
- 1 -  
Revision A3  

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