Product specification
6
9
1206
VT
SERIES
Chip Resistor Surface Mount
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
TEST METHOD
IEC60115-1 4.13
PROCEDURE
REQUIREMENTS
Short Time
Overload
2.5 times of rated voltage or maximum
±(0.05%+0.05Ω)
overload voltage, the less of the above, for 5 sec
at room temperature
High
Temperature
Exposure
AEC-Q200 Test 3
1,000 hours at Tamb = 155 °C, unpowered
±(0.3%+0.05Ω)
±(0.1%+0.05Ω)
MIL-STD-202 Method 108
Moisture
Resistance
AEC-Q200 Test 6
Each temperature / humidity cycle is defined at
8 hours (method 106F), 3 cycles / 24 hours for
10d. with 25 °C / 65 °C 95% R.H, without steps
7a & 7b, unpowered
MIL-STD-202 Method 106
Parts mounted on test-boards, without
condensation on parts
Biased
AEC-Q200 Test 7
1,000 hours; 85 °C / 85% RH
±(0.1%+0.05Ω)
Humidity
MIL-STD-202 Method 103
10% of operating power
Measurement at 24±4 hours after test conclusion
Life
AEC-Q200 Test 8
1,000 hours at 70±5 °C, RCWV applied for 1.5
hours on, 0.5 hour off, still air required
±(0.1%+0.05Ω)
±(0.05%+0.05Ω)
MIL-STD-202 Method 108
Condition B, no pre-heat of samples
Lead-free solder, 260±5 °C, 10±1 seconds
immersion time
Resistance to
Soldering
Heat
AEC-Q200 Test 15
MIL-STD-202 Method 210
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
-55/+125 °C
Thermal
Shock
AEC-Q200 Test 16
±(0.1%+0.05Ω)
Number of cycles is 300. Devices mounted
Maximum transfer time is 20 seconds.
Dwell time is 15 minutes. Air – Air
MIL-STD-202 Method 107
No visible damage
Electrical Test not required Magnification 50X
SMD conditions:
Solderability
- Wetting
AEC-Q200 Test 18
J-STD-002
Well tinned
(>95% covered)
No visible damage
(a) Method B, aging 4 hours at 155 °C dry heat,
dipping at 235±3 °C for 5±0.5 seconds.
(b) Method B, steam aging 8 hours, dipping at
215±3 °C for 5±0.5 seconds.
(c) Method D, steam aging 8 hours, dipping at
260±3 °C for 7±0.5 seconds
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Feb. 24, 2023 V.0