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VSMY7852X01_1104 PDF预览

VSMY7852X01_1104

更新时间: 2024-11-11 08:18:11
品牌 Logo 应用领域
威世 - VISHAY 二极管化工
页数 文件大小 规格书
7页 143K
描述
High Power Infrared Emitting Diode, 850 nm, Surface Emitter Techno

VSMY7852X01_1104 数据手册

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VSMY7852X01  
Vishay Semiconductors  
High Power Infrared Emitting Diode,  
850 nm, Surface Emitter Technology  
FFEATURES  
• Package type: surface mount  
• Package form: Little Star®  
• Dimensions (L x W x H in mm): 6.0 x 7.0 x 1.5  
• Peak wavelength: p = 850 nm  
• High reliability  
• High radiant power  
• High radiant intensity  
• Angle of half intensity: = 60°  
• Low forward voltage  
20783  
• Designed for high drive currents: up to 250 mA DC and up  
to 1.5 A pulses  
• Low thermal resistance: RthJP = 15 K/W  
• Floor life: 4 weeks, MSL 2a, acc. J-STD-020  
• Lead (Pb)-free reflow soldering  
• AEC-Q101 qualified  
DESCRIPTION  
VSMY7852X01 is an infrared, 850 nm emitting diode based  
on surface emitter technology with high radiant power and  
high speed, molded in low thermal resistance Little Star  
package. A 20 mil chip provides outstanding low forward  
voltage and allows DC operation of the device up to 250 mA.  
• Compliant to RoHS Directive 2002/95/EC and in  
accordance to WEEE 2002/96/EC  
AAPPLICATIONS  
• Infrared illumination for CMOS cameras (CCTV)  
• Driver assistance systems  
• Machine vision IR data transmission  
PRODUCT SUMMARY  
COMPONENT  
Ie (mW/sr)  
(deg)  
p (nm)  
tr (ns)  
VSMY7852X01  
42  
60  
850  
15  
Note  
Test conditions see table “Basic Characteristics”  
ORDERING INFORMATION  
ORDERING CODE  
PACKAGING  
Tape and reel  
REMARKS  
MOQ: 2000 pcs, 2000 pcs/reel  
PACKAGE FORM  
VSMY7852X01-GS08  
Little Star  
Note  
MOQ: minimum order quantity  
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)  
PARAMETER  
TEST CONDITION  
SYMBOL  
VALUE  
UNIT  
V
Reverse voltage  
VR  
5
Forward current  
IF  
250  
mA  
mA  
A
Peak forward current  
Surge forward current  
Power dissipation  
tp/T = 0.5, tp 100 μs  
IFM  
500  
1.5  
tp = 100 μs  
IFSM  
PV  
500  
mW  
°C  
Junction temperature  
Operating temperature range  
Storage temperature range  
Soldering temperature  
Thermal resistance junction/pin  
Tj  
125  
Tamb  
Tstg  
Tsd  
- 40 to + 100  
- 40 to + 100  
260  
°C  
°C  
Acc. figure 7, J-STD-20  
°C  
Acc. J-STD-051, soldered on PCB  
RthJP  
15  
K/W  
Document Number: 81146  
Rev. 1.0, 29-Apr-11  
For technical questions, contact: emittertechsupport@vishay.com  
This document is subject to change without notice.  
www.vishay.com  
1
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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