Class 2 X7R 10/16/25/50/100 V
Vishay BCcomponents
Surface Mount Multilayer Chip Capacitors
TEST PROCEDURES AND REQUIREMENTS
TEST
PROCEDURE
REQUIREMENTS
4) Dielectric strength
• To apply voltage (
≤
50 V) 250 %
• No evidence of damage or flash-over during test
• Duration: 1 to 5 seconds
• Charge and discharge current less than 50 mA
• To apply voltage:
100 V
≥
≥
≥
≥
3 times V DC
2 times V DC
1.5 times V DC
1.2 times V DC
200 V ~ 300 V
500 V ~ 999 V
1000 V ~ 3000 V
• Cut-off, set at 10 mA
• TEST = 15 seconds
• RAMP = 0
5) Insulation resistance
To apply rated voltage for max. 120 seconds
≥
≥
10 G
Ω
Ω
or R x C
≥
500
Ω
F whichever is smaller
Rated voltage:
100 ~ 500 V
To apply rated voltage
for 60 seconds
10 G
Rated voltage:
> 500 V
To apply 500 V for
60 seconds
≥
10 GΩ
6) Temperature coefficient With no electrical load:
T.C.
Operating Temp
T.C.
Capacitance Change
Within 30 ppm/ꢀC
Within 120 ppm/ꢀC
Within 15 %
NP0 (C0G)
NP0 (C0J)
X7R
- 55 ~ 125 ꢀC at 25 ꢀC NP0 (C0G)
- 55 ~ 125 ꢀC at 25 ꢀC NP0 (C0J)
- 55 ~ 125 ꢀC at 25 ꢀC X7R
X5R
- 55 ~ 85 ꢀC at 25 ꢀC
- 25 ~ 85 ꢀC at 20 ꢀC
X5R
Y5V
Within 15 %
Y5V
Within + 30 %/- 80 %
7) Adhesive strength of
termination
• Pressurizing force:
0201: 2N
0402 and 0603: 5 N
> 0603: 10 N
• Test time 10 1 second
• No remarkable damage or removal of the terminations
8) Vibration resistance
• Vibration frequency: 10 to 55 Hz/minute
• Total amplitude: 1.5 mm
• No remarkable damage
• Capacitance change and Q/D.F.: To meet initial specification
• Test time: 6 hours (2 hours each in 3 mutually
perpendicular directions)
9) Solderability
• Solder temperature: 235 5 ꢀC
95 % minimum coverage of all metallized area
• Dipping time:
2
0.5 seconds
10) Bending test
• The middle part of the substrate shall be
pressurized by means of the pressurizing rod
at a rate of about 1 mm per second until the
deflection becomes 1 mm and then the
pressure shall be maintained
• No remarkable damage
• Capacitance change:
NP0: within 5.0 % or 0.5 pF whichever is larger
X7R, X5R: within 12.5 %
Y5V: within 30 %
(This capacitance change means the change of capacitance under
specified flexure of substrate from the capacitance measured before the
test)
for 5 1 seconds
• Measurement to be made after keeping at
room temperature for 24 2 hours
11) Resistance to
soldering heat
• Solder temperature: 270 5 ꢀC
• No remarkable damage
• Capacitance change:
NP0: within 2.5 % or 0.25 pF whichever is larger
X7R, X5R: within 7.5 %
Y5V: within 20 %
• Q/D.F., I.R. and dielectric strength: To meet initial requirements
• 25 % maximum leaching on each edge
• Dipping time: 10 1 second
• Preheating: 120 to 150 ꢀC for 1 minute before
immerse the capacitor in a eutectic solder
• Before initial measurement (Class II only):
Perform 150 + 0/- 10 ꢀC for 1 hour and then
set for 48 4 hours at room temperature
• Measurement to be made after keeping at
room temperature for 24 2 hours (Class I)
or 48 4 hours (Class II)
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For technical questions, contact: MLCC@vishay.com
Document Number 28503
Revision: 25-Oct-06