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VJ0805Y105JXQTW1BC PDF预览

VJ0805Y105JXQTW1BC

更新时间: 2024-10-29 09:03:27
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
10页 179K
描述
CAPACITOR, CERAMIC, MULTILAYER, 10V, X7R, 1uF, SURFACE MOUNT, 0805, CHIP, ROHS COMPLIANT

VJ0805Y105JXQTW1BC 数据手册

 浏览型号VJ0805Y105JXQTW1BC的Datasheet PDF文件第1页浏览型号VJ0805Y105JXQTW1BC的Datasheet PDF文件第2页浏览型号VJ0805Y105JXQTW1BC的Datasheet PDF文件第3页浏览型号VJ0805Y105JXQTW1BC的Datasheet PDF文件第5页浏览型号VJ0805Y105JXQTW1BC的Datasheet PDF文件第6页浏览型号VJ0805Y105JXQTW1BC的Datasheet PDF文件第7页 
Class 2 X7R 10/16/25/50/100 V  
Vishay BCcomponents  
Surface Mount Multilayer Chip Capacitors  
BLISTER TAPE SPECIFICATIONS  
DIMENSIONS OF BLISTER TAPE in millimeters  
P
0
PRODUCT  
D
P
2
DIMENSION  
TOLERANCE  
0
0805  
< 1.57  
< 2.45  
8.00  
1206  
< 2.00  
< 3.60  
8.00  
A0  
-
-
E
F
B0  
W
E
0.10  
0.10  
0.05  
0.05  
0.10  
0.10  
0.10  
0.05  
W
1.75  
1.75  
F
3.50  
3.50  
B
0
D0  
D1  
P0  
P1  
P2  
1.50  
1.00  
4.00  
4.00  
1.50  
1.00  
4.00  
4.00  
A
D
1
0
direction of unreeling  
P
1
2.00  
2.00  
REEL SPECIFICATIONS  
D
C
A
B
REEL DIMENSIONS AND TAPE WIDTH in millimeters  
180 mm; 7 inch  
330 mm; 13 inch  
13.0 0.5  
A
B
C
D
13.0 1.0  
9.0 1.0  
9.0 1.0  
178.0 1.0  
60.5 1.0  
330.0 1.0  
100.0 1.0  
METHOD OF MOUNTING AND DIMENSIONS OF SOLDER LANDS  
For normal use the capacitors may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering and  
reflow soldering.  
An improper combination of soldering, substrate and chip size can lead to a damaging of the component. The risk increases with  
the chip size and with temperature fluctuations (> 100 ꢀC) Therefore, it is advised to use the smallest possible size and follow the  
dimensional recommendations given.  
Document Number 28503  
Revision 25-Oct-06  
For technical questions, contact: MLCC@vishay.com  
www.vishay.com  
23  

VJ0805Y105JXQTW1BC 替代型号

型号 品牌 替代类型 描述 数据表
0805ZC105JAT2A KYOCERA AVX

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