是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFP |
包装说明: | HTFQFP, TQFP100,.63SQ | 针数: | 100 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
Factory Lead Time: | 6 weeks | 风险等级: | 5.09 |
商用集成电路类型: | CONSUMER CIRCUIT | JESD-30 代码: | S-PQFP-G100 |
JESD-609代码: | e4 | 长度: | 14 mm |
湿度敏感等级: | 3 | 功能数量: | 1 |
端子数量: | 100 | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HTFQFP | 封装等效代码: | TQFP100,.63SQ |
封装形状: | SQUARE | 封装形式: | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 3.3 V |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
子类别: | Other Consumer ICs | 最大压摆率: | 370 mA |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | MILITARY | 端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 14 mm | Base Number Matches: | 1 |
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