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V62/09643-01XE

更新时间： 2024-11-17 07:05:55
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
156页 1615K
描述
Digital Media System-on-Chip(DMSoC)

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V62/09643-01XE 技术参数

生命周期：Active零件包装代码：BGA
包装说明：LFBGA, BGA337,19X19,25针数：337
Reach Compliance Code：not_compliant风险等级：5.62
位大小：32总线兼容性：I2C; SPI; UART; USB
外部数据总线宽度：32格式：FIXED POINT
JESD-30 代码：S-PBGA-B337JESD-609代码：e0
长度：13 mm湿度敏感等级：3
端子数量：337最高工作温度：125 °C
最低工作温度：-55 °C封装主体材料：PLASTIC/EPOXY
封装代码：LFBGA封装等效代码：BGA337,19X19,25
封装形状：SQUARE封装形式：GRID ARRAY, LOW PROFILE, FINE PITCH
电源：1.3,1.8,3.3 VRAM（字数）：8192
座面最大高度：1.3 mm子类别：Digital Signal Processors
最大供电电压：1.365 V最小供电电压：1.235 V
标称供电电压：1.3 V表面贴装：YES
技术：CMOS温度等级：MILITARY
端子面层：Tin/Lead (Sn/Pb)端子形式：BALL
端子节距：0.65 mm端子位置：BOTTOM
宽度：13 mmuPs/uCs/外围集成电路类型：MICROPROCESSOR CIRCUIT
Base Number Matches：1

V62/09643-01XE 数据手册

 浏览型号V62/09643-01XE的Datasheet PDF文件第2页浏览型号V62/09643-01XE的Datasheet PDF文件第3页浏览型号V62/09643-01XE的Datasheet PDF文件第4页浏览型号V62/09643-01XE的Datasheet PDF文件第5页浏览型号V62/09643-01XE的Datasheet PDF文件第6页浏览型号V62/09643-01XE的Datasheet PDF文件第7页 
SM320DM355-EP  
Digital Media System-on-Chip (DMSoC)  
www.ti.com  
SPRS575–JULY 2009  
1 SM320DM355-EP Digital Media System-on-Chip (DMSoC)  
1.1 Features  
Digital Output  
BT.601/BT.656 Digital YCbCr 4:2:2  
(8-/16-Bit) Interface  
Supports digital HDTV (720p/1080i)  
output for connection to external  
encoder  
•
High-Performance Digital Media  
System-on-Chip  
•
•
–
135-, 216-, and 270-MHz ARM926EJ-S Clock  
Rate; and Up to 216 MHz in M-Temp  
(M216EP)  
–
Fully Software-Compatible With ARM9™  
•
•
External Memory Interfaces (EMIFs)  
•
ARM926EJ-S Core  
–
DDR2 and mDDR SDRAM 16-bit wide EMIF  
With 256 MByte Address Space (1.8-V I/O)  
–
Support for 32-Bit and 16-Bit (Thumb Mode)  
Instruction Sets  
–
Asynchronous16-/8-bit Wide EMIF (AEMIF)  
–
DSP Instruction Extensions and Single  
Cycle MAC  
•
Flash Memory Interfaces  
–
–
NAND (8-/16-bit Wide Data)  
OneNAND(16-bit Wide Data)  
–
–
ARM® Jazelle® Technology  
EmbeddedICE-RT™ Logic for Real-Time  
Debug  
Flash Card Interfaces  
•
ARM9 Memory Architecture  
–
Two Multimedia Card (MMC) / Secure  
Digital (SD/SDIO)  
SmartMedia  
–
–
–
–
–
16K-Byte Instruction Cache  
8K-Byte Data Cache  
32K-Byte RAM  
8K-Byte ROM  
Little Endian  
–
•
•
Enhanced Direct-Memory-Access (EDMA)  
Controller (64 Independent Channels)  
USB Port with Integrated 2.0 High-Speed PHY  
that Supports  
–
–
Three 64-Bit General-Purpose Timers (each  
configurable as two 32-bit timers)  
One 64-Bit Watch Dog Timer  
Three UARTs (One fast UART with RTS and  
CTS Flow Control)  
•
•
MPEG4/JPEG Coprocessor  
Fixed Function Coprocessor Supports:  
USB 2.0 Full and High-Speed Device  
USB 2.0 Low, Full, and High-Speed Host  
–
•
MPEG4 SP Codec at HD (720p), D1,  
VGA, SIF  
•
•
JPEG Codec up to 50M Pixels per  
Second  
•
•
Video Processing Subsystem  
– Front End Provides:  
•
•
•
Three Serial Port Interfaces (SPI) each with  
two Chip-Selects  
•
Hardware IPIPE for Real-Time Image  
Processing  
Up to 14-bit CCD/CMOS Digital Interface  
16-/8-bit Generic YcBcR-4:2 Interface  
(BT.601)  
One Master/Slave Inter-Integrated Circuit (I2C)  
Bus®  
•
•
Two Audio Serial Port (ASP)  
–
–
–
–
–
I2S and TDM I2S  
AC97 Audio Codec Interface  
S/PDIF via Software  
Standard Voice Codec Interface (AIC12)  
SPI Protocol (Master Mode Only)  
•
•
•
•
10-/8-bit CCIR6565/BT655 Interface  
Up to 75-MHz Pixel Clock  
Histogram Module  
Resize Engine  
–
–
–
Resize Images From 1/16x to 8x  
Separate Horizontal/Vertical Control  
Two Simultaneous Output Paths  
•
•
•
Four Pulse Width Modulator (PWM) Outputs  
Four RTO (Real Time Out) Outputs  
Up to 104 General-Purpose I/O (GPIO) Pins  
(Multiplexed with Other Device Functions)  
On-Chip ARM ROM Bootloader (RBL) to Boot  
From NAND Flash, MMC/SD, USB, or UART  
Configurable Power-Saving Modes  
–
Back End Provides:  
•
•
Hardware On-Screen Display (OSD)  
Composite NTSC/PAL video encoder  
output  
•
•
•
8-/16-bit YCC and Up to 18-Bit RGB666  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this document.  
Windows is a trademark of Microsoft.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009, Texas Instruments Incorporated  
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