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V3P22-M3/I PDF预览

V3P22-M3/I

更新时间: 2024-11-15 02:51:39
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
5页 105K
描述
Surface-Mount TMBS® (Trench MOS Barrier Schottky) Rectifier

V3P22-M3/I 数据手册

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V3P22  
www.vishay.com  
Vishay General Semiconductor  
Surface-Mount TMBS® (Trench MOS Barrier Schottky) Rectifier  
FEATURES  
• Low profile package  
eSMP® Series  
Available  
• Trench MOS Schottky technology  
• Low power losses, high efficiency  
• Low forward voltage drop  
• Meets MSL level 1, per J-STD-020, LF maximum  
peak of 260 °C  
• AEC-Q101 qualified available  
SMP (DO-220AA)  
- Automotive ordering code; base P/NHM3  
Cathode  
Anode  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
DESIGN SUPPORT TOOLS AVAILABLE  
TYPICAL APPLICATIONS  
3
D
3
D
For use in low voltage, high frequency inverters,  
freewheeling, DC/DC converters, and polarity protection  
applications.  
3D Models  
PRIMARY CHARACTERISTICS  
MECHANICAL DATA  
Case: SMP (DO-220AA)  
Molding compound meets UL 94 V-0 flammability rating  
IF(AV)  
3.0 A  
200 V  
60 A  
VRRM  
Base P/N-M3  
commercial grade  
Base P/NHM3  
AEC-Q101 qualified  
-
halogen-free, RoHS-compliant, and  
IFSM  
VF at IF = 3.0 A  
TJ max.  
0.70 V  
175 °C  
-
halogen-free, RoHS-compliant, and  
Package  
SMP (DO-220AA)  
Single  
Terminals: matte tin plated leads, solderable per  
J-STD-002 and JESD 22-B102  
M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix  
Circuit configuration  
meets JESD 201 class 2 whisker test  
Polarity: color band denotes the cathode end  
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)  
PARAMETER  
SYMBOL  
V3P22  
V3D  
200  
3
UNIT  
Device marking code  
Maximum repetitive peak reverse voltage  
VRRM  
V
A
A
(1)  
IF(AV)  
Maximum DC forward current  
(2)  
IF(AV)  
1.7  
Peak forward surge current 10 ms single half sine-wave  
superimposed on rated load  
IFSM  
60  
A
(3)  
Operating junction and storage temperature range  
Operating junction and storage temperature range  
TJ  
-40 to +175  
-55 to +175  
°C  
°C  
TSTG  
Notes  
(1)  
(2)  
(3)  
Mounted on 10 mm x 10 mm PCB pad area  
Free air, mounted on recommended copper pad area  
The heat generated must be less than the thermal conductivity from junction-to-ambient: dPD/dTJ < 1/RJA  
Revision: 03-Jun-2019  
Document Number: 87471  
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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