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UPD44646093AF5-E20-FQ1-A PDF预览

UPD44646093AF5-E20-FQ1-A

更新时间: 2024-01-29 19:37:39
品牌 Logo 应用领域
瑞萨 - RENESAS 时钟双倍数据速率静态存储器内存集成电路
页数 文件大小 规格书
42页 786K
描述
IC,SYNC SRAM,DDR,8MX9,CMOS,BGA,165PIN,PLASTIC

UPD44646093AF5-E20-FQ1-A 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliant风险等级:5.8
最长访问时间:0.45 ns最大时钟频率 (fCLK):500 MHz
I/O 类型:COMMONJESD-30 代码:R-PBGA-B165
内存密度:75497472 bit内存集成电路类型:STANDARD SRAM
内存宽度:9端子数量:165
字数:8388608 words字数代码:8000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:8MX9
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA165,11X15,40
封装形状:RECTANGULAR封装形式:GRID ARRAY
并行/串行:PARALLEL电源:1.5,1.8 V
认证状态:Not Qualified最大待机电流:0.44 A
最小待机电流:1.7 V子类别:SRAMs
最大压摆率:0.69 mA表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:BALL端子节距:1 mm
端子位置:BOTTOMBase Number Matches:1

UPD44646093AF5-E20-FQ1-A 数据手册

 浏览型号UPD44646093AF5-E20-FQ1-A的Datasheet PDF文件第1页浏览型号UPD44646093AF5-E20-FQ1-A的Datasheet PDF文件第2页浏览型号UPD44646093AF5-E20-FQ1-A的Datasheet PDF文件第4页浏览型号UPD44646093AF5-E20-FQ1-A的Datasheet PDF文件第5页浏览型号UPD44646093AF5-E20-FQ1-A的Datasheet PDF文件第6页浏览型号UPD44646093AF5-E20-FQ1-A的Datasheet PDF文件第7页 
DATA SHEET  
MOS INTEGRATED CIRCUIT  
μPD44646092A-A, 44646182A-A, 44646362A-A, 44646093A-A, 44646183A-A, 44646363A-A  
72M-BIT DDR II+ SRAM  
2.0 & 2.5 CLOCK CYCLES READ LATENCY  
2-WORD BURST OPERATION  
Description  
The μPD44646092A-A and μPD44646093A-A are 8,388,608-word by 9-bit, the μPD44646182A-A and μPD44646183A-A  
are 4,194,304-word by 18-bit and the μPD44646362A-A and μPD44646363A-A are 2,097,152-word by 36-bit synchronous  
double data rate static RAM fabricated with advanced CMOS technology using full CMOS six-transistor memory cell.  
The μPD44646xx2A-A is for 2.0 clock cycles and the μPD44646xx3A-A is for 2.5 clock cycles read latency. The  
μPD44646092A-A, μPD44646093A-A, μPD44646182A-A, μPD44646183A-A, μPD44646362A-A and μPD44646363A-A  
integrate unique synchronous peripheral circuitry and a burst counter. All input registers controlled by an input clock pair (K  
and K#) are latched on the positive edge of K and K#.  
These products are suitable for application which require synchronous operation, high speed, low voltage, high density  
and wide bit configuration.  
These products are packaged in 165-pin PLASTIC BGA.  
Features  
1.8 ± 0.1 V power supply  
165-pin PLASTIC BGA (15 x 17)  
HSTL interface  
DLL/PLL circuitry for wide output data valid window and future frequency scaling  
Pipelined double data rate operation  
Common data input/output bus  
Two-tick burst for low DDR transaction size  
Two input clocks (K and K#) for precise DDR timing at clock rising edges only  
Two Echo clocks (CQ and CQ#)  
Data Valid pin (QVLD) supported  
Read latency : 2.0 & 2.5 clock cycles (Not selectable by user)  
Internally self-timed write control  
Clock-stop capability. Normal operation is restored in 20 μs after clock is resumed.  
User programmable impedance output (35 to 70 Ω)  
Fast clock cycle time : 2.5 ns (400 MHz) for 2.0 clock cycles read latency,  
2.0 ns (500 MHz) for 2.5 clock cycles read latency  
Simple control logic for easy depth expansion  
JTAG 1149.1 compatible test access port  
On-Die Termination (ODT) for better signal quality (Selectable ON/OFF by user)  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all products and/or types are available in every country. Please check with an NEC Electronics  
sales representative for availability and additional information.  
Document No. M19960EJ2V0DS00 (2nd edition)  
Date Published March 2010  
Printed in Japan  
2009, 2010  

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