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UPD16833AG3 PDF预览

UPD16833AG3

更新时间： 2024-10-13 22:41:39
品牌 Logo 应用领域
日电电子 - NEC 驱动器
页数 文件大小 规格书
12页 91K
描述
MONOLITHIC QUAD H BRIDGE DRIVER CIRCUIT

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中文翻译

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UPD16833AG3 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
零件包装代码：SSOP包装说明：SSOP,
针数：30Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8542.39.00.01
风险等级：5.92内置保护：UNDER VOLTAGE
接口集成电路类型：HALF BRIDGE BASED PERIPHERAL DRIVERJESD-30 代码：R-PDSO-G30
JESD-609代码：e0长度：9.85 mm
功能数量：4端子数量：30
最高工作温度：85 °C最低工作温度：-10 °C
输出电流流向：SOURCE AND SINK标称输出峰值电流：0.2 A
封装主体材料：PLASTIC/EPOXY封装代码：SSOP
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, SHRINK PITCH
峰值回流温度（摄氏度）：NOT SPECIFIED认证状态：Not Qualified
座面最大高度：2 mm最大供电电压：5.5 V
最小供电电压：2.5 V标称供电电压：3 V
电源电压1-最大：5.5 V电源电压1-分钟：2.7 V
电源电压1-Nom：3 V表面贴装：YES
技术：MOS温度等级：OTHER
端子面层：TIN LEAD端子形式：GULL WING
端子节距：0.65 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED断开时间：0.5 µs
接通时间：20 µs宽度：6.1 mm
Base Number Matches：1

UPD16833AG3 数据手册

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DATA SHEET  
MOS INTEGRATED CIRCUIT  
µPD16833A  
MONOLITHIC QUAD H BRIDGE DRIVER CIRCUIT  
DESCRIPTION  
The µPD16833A is a monolithic quad H bridge driver IC which uses power MOS FETs in its driver stage. By using the  
MOS FETs in the output stage, this driver IC has a substantially improved saturation voltage and power consumption as  
compared with conventional driver circuits using bipolar transistors.  
A low-voltage malfunction prevention function is provided to prevent the IC from malfunctioning when the supply voltage  
drops. By eliminating the charge pump circuit, the current during power-OFF is drastically decreased.  
As the package, a 30-pin plastic shrink SOP is employed to enable the creation of compact, slim application sets.  
This driver IC can drive two stepping motors at the same time, and is ideal for driving stepping motors in the lens of a  
video camera.  
FEATURES  
•
•
Four H bridge circuits employing power MOS FETs  
Low current consumption by eliminating charge pump  
VM pin current when power-OFF: 10 µA MAX. VDD pin current: 10 µA MAX.  
Input logic frequency: 100 kHz  
•
•
3-V power supply  
Minimum operating supply voltage: 2.5 V  
•
•
Low-voltage malfunctioning prevention circuit  
30-pin plastic shrink SOP (300 mil) (µPD16833AG3)  
ORDERING INFORMATION  
Part Number  
Package  
30-pin plastic shrink SOP (300 mil)  
µPD16833AG3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)  
Parameter  
Symbol  
VDD  
Conditions  
Rating  
–0.5 to +6.0  
–0.5 to +6.0  
–0.5 to VDD + 0.5  
±300  
Unit  
V
Supply voltage  
Input voltage  
VM  
V
VIN  
V
Note 1  
H bridge drive current  
IDR (DC)  
IDR (pulse)  
PT  
DC  
PW ≤ 10 ms, Duty ≤ 5 %  
mA  
mA  
W
Note 1  
Instantaneous H bridge drive current  
±700  
Note 2  
Power dissipation  
1.19  
Peak junction temperature  
Storage temperature range  
TCH (MAX)  
Tstg  
150  
°C  
°C  
–55 to +150  
Notes 1. Permissible current per phase, when mounted on a printed circuit board  
2. When mounted on a glass epoxy board (10 cm × 10 cm × 1 mm)  
The information in this document is subject to change without notice.  
Document No. S13147EJ1V0DS00 (1st edition)  
Date Published January 1998 N CP(K)  
Printed in Japan  
1998  
©
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中文翻译

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