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UPC8002GR-E1 PDF预览

UPC8002GR-E1

更新时间: 2024-11-24 22:11:51
品牌 Logo 应用领域
日电电子 - NEC 无绳电话集成电路电信集成电路电信电路放大器光电二极管无绳技术
页数 文件大小 规格书
32页 209K
描述
SECOND MIXER IF AMPLIFIER FOR DIGITAL CORDLESS TELEPHONES

UPC8002GR-E1 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:0.225 INCH, PLASTIC, SSOP-20Reach Compliance Code:compliant
风险等级:5.92JESD-30 代码:R-PDSO-G20
JESD-609代码:e0功能数量:1
端子数量:20最高工作温度:85 °C
最低工作温度:-30 °C封装主体材料:PLASTIC/EPOXY
封装代码:LSSOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, LOW PROFILE, SHRINK PITCH峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified座面最大高度:1.45 mm
标称供电电压:3 V表面贴装:YES
技术:BIPOLAR电信集成电路类型:CORDLESS TELEPHONE SUPPORT CIRCUIT
温度等级:OTHER端子面层:TIN LEAD
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:4.4 mmBase Number Matches:1

UPC8002GR-E1 数据手册

 浏览型号UPC8002GR-E1的Datasheet PDF文件第2页浏览型号UPC8002GR-E1的Datasheet PDF文件第3页浏览型号UPC8002GR-E1的Datasheet PDF文件第4页浏览型号UPC8002GR-E1的Datasheet PDF文件第5页浏览型号UPC8002GR-E1的Datasheet PDF文件第6页浏览型号UPC8002GR-E1的Datasheet PDF文件第7页 
DATA SHEET  
BIPOLAR ANALOG INTEGRATED CIRCUIT  
µPC8002  
SECOND MIXER + IF AMPLIFIER  
FOR DIGITAL CORDLESS TELEPHONES  
The µPC8002 is a monolithic IC developed for use in digital cordless telephones. Its internal equivalent circuits  
comprise a double balanced mixer (DBM), IF amplifier circuit, and RSSI (Received Signal Strength Indicator) circuit.  
The µPC8002 can operate on a wide range of power supply voltages from 2.7 V to 5.5 V, and incorporates a power-  
off function, making it ideal for achieving low set power consumption.  
The package is a 20-pin plastic shrink SOP (225 mil) suitable for high-density surface mounting.  
FEATURES  
Low-voltage, low-consumption-current operation possible (VCC = 2.7 to 5.5 V, ICC = 3.4 mA at VCC = 3 V)  
Wide mixer input frequency range (fMIX = 250 MHz (TYP.) to 500 MHz (MAX.))  
Wide IF amplifier input frequency range (fIF = 8 MHz (MIN.) to 12 MHz (MAX.), 10.7 MHz (TYP.))  
High limiting sensitivity (SL = –100 dBm (TYP.))  
Wide RSSI dynamic range (DR = 85 dB (TYP.))  
On-chip power-off function  
Use of 20-pin plastic shrink SOP (225 mil) allows high-density surface mounting  
BLOCK DIAGRAM  
GND  
V
CC  
BYPASS1 IF1 IN BYPASS2 IF1 OUT BYPASS4 IF2 IN BYPASS3 (IF OUT) (IF OUT) IF2 OUT  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
IF Amp 1  
IF Amp 2  
Output Stage  
Power ON/OFF  
RSSI  
RSSI  
2nd MIXER  
1
2
3
4
5
6
7
8
9
10  
PD  
MIX OUT  
V
CC (IF)  
V
CC (MIX) LO IN GND(IF) GND(MIX) MIX IN1 MIX IN2 RSSI OUT  
ORDERING INFORMATION  
Part Number  
Package  
µPC8002GR  
20-pin plastic shrink SOP (225 mil)  
µPC8002GR-E1  
20-pin plastic shrink SOP (225 mil)  
Embossed carrier taping (pin 1 is tape unwinding direction)  
µPC8002GR-E2  
20-pin plastic shrink SOP (225 mil)  
Embossed carrier taping (pin 1 is tape winding direction)  
The information in this document is subject to change without notice.  
Document No. S10717EJ2V0DS00 (2nd edition)  
Date Published March 1997 N  
Printed in Japan  
1997  
©

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