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UESD5.0DT5G PDF预览

UESD5.0DT5G

更新时间: 2024-01-19 19:55:02
品牌 Logo 应用领域
安森美 - ONSEMI 瞬态抑制器二极管光电二极管局域网
页数 文件大小 规格书
4页 40K
描述
ESD Protection Diodes - In Ultra Small SOT−723 Package

UESD5.0DT5G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:R-PDSO-F3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.50Factory Lead Time:1 week
风险等级:1.56最小击穿电压:6.2 V
配置:COMMON ANODE, 2 ELEMENTS二极管元件材料:SILICON
二极管类型:TRANS VOLTAGE SUPPRESSOR DIODEJESD-30 代码:R-PDSO-F3
JESD-609代码:e3湿度敏感等级:1
元件数量:2端子数量:3
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性:UNIDIRECTIONAL最大功率耗散:0.24 W
认证状态:Not Qualified最大重复峰值反向电压:5 V
子类别:Transient Suppressors表面贴装:YES
技术:AVALANCHE端子面层:Tin (Sn)
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:40Base Number Matches:1

UESD5.0DT5G 数据手册

 浏览型号UESD5.0DT5G的Datasheet PDF文件第2页浏览型号UESD5.0DT5G的Datasheet PDF文件第3页浏览型号UESD5.0DT5G的Datasheet PDF文件第4页 
mESD3.3DT5G SERIES  
ESD Protection Diodes  
In Ultra Small SOT−723 Package  
The mESD Series is designed to protect voltage sensitive components  
from ESD. Excellent clamping capability, low leakage, and fast response  
time, make these parts ideal for ESD protection on designs where board  
space is at a premium. Because of its small size, it is suited for use in  
cellular phones, portable devices, digital cameras, power supplies and  
many other portable applications.  
http://onsemi.com  
1
2
PIN 1. CATHODE  
2. CATHODE  
3. ANODE  
Specification Features:  
3
Small Body Outline Dimensions:  
0.047x 0.032(1.20 mm x 0.80 mm)  
Low Body Height: 0.020(0.5 mm)  
Stand−off Voltage: 3.3 V − 6.0 V  
Low Leakage  
MARKING  
DIAGRAM  
3
Response Time is Typically < 1 ns  
ESD Rating of Class 3 (> 16 kV) per Human Body Model  
IEC61000−4−2 Level 4 ESD Protection  
IEC61000−4−4 Level 4 EFT Protection  
These are Pb−Free Devices  
2
1
xx M  
SOT−723  
CASE 631AA  
STYLE 4  
xx = Device Code  
M
= Date Code  
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic  
Epoxy Meets UL 94 V−0  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
ORDERING INFORMATION  
Device  
mESDxxDT5G  
Package  
Shipping  
SOT−723 8000/Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
MAXIMUM RATINGS  
Rating  
IEC 61000−4−2 (ESD)  
Symbol  
Value  
Unit  
Air  
Contact  
±30  
±30  
kV  
DEVICE MARKING INFORMATION  
IEC 61000−4−4 (EFT)  
40  
A
See specific marking information in the device marking  
column of the table on page 2 of this data sheet.  
ESD Voltage  
Per Human Body Model  
Per Machine Model  
16  
400  
kV  
V
Total Power Dissipation on FR−5 Board  
mW  
mW/°C  
(Note 1) @ T = 25°C  
P
D
240  
1.9  
A
Derate above 25°C  
°C/W  
Thermal Resistance Junction−to−Ambient  
R
525  
q
JA  
Junction and Storage Temperature Range  
T , T  
−55 to  
+150  
°C  
J
stg  
Lead Solder Temperature − Maximum  
(10 Second Duration)  
T
L
260  
°C  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
1. FR−5 = 1.0 x 0.75 x 0.62 in.  
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
April, 2005 − Rev. 0  
mESD3.3DT5G/D  
 

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