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ESD11A5.0DT5G PDF预览

ESD11A5.0DT5G

更新时间： 2024-09-26 06:57:55
品牌 Logo 应用领域
安森美 - ONSEMI 二极管
页数 文件大小 规格书
5页 175K
描述
Transient Voltage Suppressors ESD Protection Diodes in Ultra Small SOT−1123 Package

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ESD11A5.0DT5G 技术参数

是否无铅： 不含铅生命周期：End Of Life
针数：3Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8541.10.00.50
Factory Lead Time：1 week风险等级：6.24
最小击穿电压：6.2 V配置：COMMON ANODE, 2 ELEMENTS
二极管元件材料：SILICON二极管类型：TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码：R-PDSO-F3JESD-609代码：e3
湿度敏感等级：1元件数量：2
端子数量：3最高工作温度：125 °C
最低工作温度：-55 °C封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：NOT SPECIFIED极性：UNIDIRECTIONAL
最大功率耗散：0.15 W认证状态：Not Qualified
最大重复峰值反向电压：5 V表面贴装：YES
技术：AVALANCHE端子面层：Tin (Sn)
端子形式：FLAT端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED

ESD11A5.0DT5G 数据手册

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ESD11A3.3DT5G SERIES  
Transient Voltage  
Suppressors  
ESD Protection Diodes in Ultra Small  
SOT−1123 Package  
The ESD11A Series is designed to protect voltage sensitive  
components from damage due to ESD. These parts provide excellent  
ESD clamping capability and fast response time to enhance the  
immunity of the end application from system level ESD stress such as  
IEC61000−4−2. Two uni−directional TVS diodes are housed in the ultra  
small SOT−1123 package, making these parts ideal for ESD protection  
on designs where board space is at a premium, such as cell phones, MP3  
players and many other portable handheld electronic devices.  
http://onsemi.com  
1
2
PIN 1. CATHODE  
2. CATHODE  
3. ANODE  
3
MARKING  
DIAGRAM  
Specification Features:  
• Low Clamping Voltage  
• Small Body Outline Dimensions:  
0.039” x 0.024” (1.0 mm x 0.6 mm)  
• Low Body Height: 0.016″ (0.4 mm)  
• Stand−off Voltage: 3.3 V − 5 V  
• Low Leakage  
X M  
SOT−1123  
CASE 524AA  
X
= Specific Device Code  
M = Date Code  
• Response Time is Typically < 1 ns  
• IEC61000−4−2 Level 4 ESD Protection  
• These are Pb−Free Devices  
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic  
Epoxy Meets UL 94 V−0  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
ORDERING INFORMATION  
†
Device  
Package  
Shipping  
ESD11AxxDT5G SOT−1123 8000/Tape & Reel  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
MAXIMUM RATINGS  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the table on page 2 of this data sheet.  
Rating  
Symbol  
Value  
15  
Unit  
kV  
IEC 61000−4−2 (ESD)  
Contact  
Total Power Dissipation on FR−5 Board  
°P °  
D
150  
mW  
(Note 1) @ T = 25°C  
A
Storage Temperature Range  
Junction Temperature Range  
T
−55 to +150  
−55 to +125  
260  
°C  
°C  
°C  
stg  
T
J
Lead Solder Temperature − Maximum  
(10 Second Duration)  
T
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR−5 = 1.0 x 0.75 x 0.62 in.  
See Application Note AND8308/D for further description of ESD maximum ratings.  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
October, 2009 − Rev. 1  
ESD11A3.3D/D  
 
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ESD11A5.0DT5G 替代型号

型号 品牌 替代类型 描述 数据表
NZL5V6AUA3 ONSEMI

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 UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE, MICROLEADLESS, PLASTIC, 1006, 3 PIN
UESD5.0DT5G ONSEMI

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PESD5V0S2UQ NXP

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 Double ESD protection diodes in SOT663 package

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