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ESD11N5.0ST5G PDF预览

ESD11N5.0ST5G

更新时间： 2024-02-03 22:31:35
品牌 Logo 应用领域
安森美 - ONSEMI 二极管
页数 文件大小 规格书
4页 128K
描述
Transient Voltage Suppressors Micro−Packaged Diodes for ESD Protection

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ESD11N5.0ST5G 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：R-XBCC-N2
针数：2Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8541.10.00.50
风险等级：1.55其他特性：LOW CAPACITANCE
最小击穿电压：5.8 V击穿电压标称值：5.8 V
最大钳位电压：12 V配置：SINGLE
二极管元件材料：SILICON二极管类型：TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码：R-XBCC-N2湿度敏感等级：1
元件数量：1端子数量：2
最高工作温度：125 °C最低工作温度：-40 °C
封装主体材料：UNSPECIFIED封装形状：RECTANGULAR
封装形式：CHIP CARRIER峰值回流温度（摄氏度）：NOT SPECIFIED
极性：BIDIRECTIONAL最大功率耗散：0.25 W
认证状态：Not Qualified最大重复峰值反向电压：5 V
子类别：Transient Suppressors表面贴装：YES
技术：AVALANCHE端子形式：NO LEAD
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
Base Number Matches：1

ESD11N5.0ST5G 数据手册

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ESD11N5.0ST5G  
Transient Voltage  
Suppressors  
Micro−Packaged Diodes for ESD Protection  
The ESD11N is designed to protect voltage sensitive components  
that require ultra−low capacitance from ESD and transient voltage  
events. Excellent clamping capability, low capacitance, low leakage,  
and fast response time, make these parts ideal for ESD protection on  
designs where board space is at a premium. Because of its low  
capacitance, it is suited for use in high frequency designs such as USB  
2.0 high speed and antenna line applications.  
http://onsemi.com  
Specification Features  
MARKING  
DIAGRAM  
• Low Capacitance 0.6 pF  
• Low Clamping Voltage  
PIN 1  
• Small Body Outline Dimensions: 0.60 mm x 0.30 mm  
• Low Body Height: 0.3 mm  
• Stand−off Voltage: 5.0 V  
• Low Leakage  
DSN2  
CASE 152AA  
XXXX  
YYY  
XXXX  
YYY  
= Specific Device Code  
= Year Code  
• Response Time is < 1 ns  
• IEC61000−4−2 Level 4 ESD Protection  
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
ORDERING INFORMATION  
†
Device  
ESD11N5.0ST5G  
Package  
Shipping  
Mechanical Characteristics  
DSN2  
5000/Tape & Reel  
(Pb−Free)  
MOUNTING POSITION: Any  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Device Meets MSL 1 Requirements  
MAXIMUM RATINGS  
Rating  
IEC 61000−4−2 (ESD)  
Symbol  
Value  
Unit  
Contact  
Air  
8.0  
15  
kV  
Total Power Dissipation on FR−5 Board  
°P °  
250  
mW  
D
(Note 1) @ T = 25°C  
A
Thermal Resistance, Junction−to−Ambient  
R
q
JA  
400  
−40 to +125  
260  
°C/W  
°C  
Junction and Storage Temperature Range T , T  
J
stg  
Lead Solder Temperature − Maximum  
(10 Second Duration)  
T
°C  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR−5 = 1.0 x 0.75 x 0.62 in.  
See Application Note AND8308/D for further description of survivability specs.  
©
Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
July, 2009 − Rev. 2  
ESD11N5.0S/D  
 
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