Datasheet > UE75-A30-6101T

UE75-A30-6101T

更新时间： 2024-01-07 23:02:05

品牌	Logo	应用领域
安费诺 - AMPHENOL		连接器
页数	文件大小	规格书
2页	96K
描述
Telecom and Datacom Connector

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UE75-A30-6101T 技术参数

生命周期：	Active	Reach Compliance Code：	unknown
风险等级：	5.7	连接器类型：	TELECOM AND DATACOM CONNECTOR
Base Number Matches：	1

UE75-A30-6101T 数据手册

ExpressPort XFP+

XFP

U79-A141-2D01

The XFP interconnect system is capable of a 10 Gbps data rate and is intended for external I/O connections.

High speed serial interconnect applications include clusters, servers and storage devices. It is a smaller space

and lower cost alternative to parallel-optics VSR. XFP also requires less than one-third the power and physical

space of an MSA interconnect with parallel interface.

The Expressport™ XFP+ Connector is designed to extend performance to 14 Gbps. Please consult

Amphenol Factory for availability.

Speciﬁcation Highlights

The XFP interconnect system is comprised of a press-ﬁt cage assembly which is used with 30-position,

0.8 mm pitch SMT connectors complying with INF-8077i.

Mechanical Characteristics

Materials

• Cage

• Base material: copper alloy

• Insertion force: 40 N max (cage and connector)

• Withdrawal force: 30 N max (cage and connector)

• Cage retention: 180 N min (latch strength)

• Durability: 250 mating cycles minimum

• Plating: nickel

• Front ﬂange: zinc alloy

• Heat sink: aluminum alloy

Electrical Characteristics

• Operating voltage: 30 V

• Heat sink clip: stainless steel

• Dust cover: thermoplastic

• Operating current: 0.5 A

• Connector

• Differential impedance: 100 Ω+/- 5 Ω

• Contact base material: copper alloy

• Contact plating: gold on mating area;

gold or matte tin on termination

• Housings: glass reinforced, lead-free solder reﬂow process

compatible thermoplastic, UL94V-0 rated

• DWV: 300 V AC

• Insulation resistance: 1000 MΩ min

• Contact resistance: 70 mΩ max

• Near-end isolation: -40 dB

• Insertion loss: 1.0 dB max

Temperature Rating

Options

• Operating temperature: -40 °C to +85 °C

• Heat sink

• Storage temperature: -40 °C to +85 °C

• Dust cover

• EMI shielding

Packaging

• Conductive elastomeric gasket at back of cage

• Mylar tape

• Tape and reel packaging: connector or cage

• Tray packaging: cage

• Bulk packaging: dust cover

XFP Connector

UE75-A30-3000T

XFP Cage with 45 Fin Heat Sink

U79-A1G1-2001

中文翻译

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