TM
ExpressPort XFP+
XFP
U79-A141-2D01
The XFP interconnect system is capable of a 10 Gbps data rate and is intended for external I/O connections.
High speed serial interconnect applications include clusters, servers and storage devices. It is a smaller space
and lower cost alternative to parallel-optics VSR. XFP also requires less than one-third the power and physical
space of an MSA interconnect with parallel interface.
The Expressport™ XFP+ Connector is designed to extend performance to 14 Gbps. Please consult
Amphenol Factory for availability.
Specification Highlights
The XFP interconnect system is comprised of a press-fit cage assembly which is used with 30-position,
0.8 mm pitch SMT connectors complying with INF-8077i.
Mechanical Characteristics
Materials
• Cage
• Base material: copper alloy
• Insertion force: 40 N max (cage and connector)
• Withdrawal force: 30 N max (cage and connector)
• Cage retention: 180 N min (latch strength)
• Durability: 250 mating cycles minimum
• Plating: nickel
• Front flange: zinc alloy
• Heat sink: aluminum alloy
Electrical Characteristics
• Operating voltage: 30 V
• Heat sink clip: stainless steel
• Dust cover: thermoplastic
• Operating current: 0.5 A
• Connector
• Differential impedance: 100 Ω+/- 5 Ω
• Contact base material: copper alloy
• Contact plating: gold on mating area;
gold or matte tin on termination
• Housings: glass reinforced, lead-free solder reflow process
compatible thermoplastic, UL94V-0 rated
• DWV: 300 V AC
• Insulation resistance: 1000 MΩ min
• Contact resistance: 70 mΩ max
• Near-end isolation: -40 dB
• Insertion loss: 1.0 dB max
Temperature Rating
Options
• Operating temperature: -40 °C to +85 °C
• Heat sink
• Storage temperature: -40 °C to +85 °C
• Dust cover
• EMI shielding
Packaging
• Conductive elastomeric gasket at back of cage
• Mylar tape
• Tape and reel packaging: connector or cage
• Tray packaging: cage
• Bulk packaging: dust cover
XFP Connector
UE75-A30-3000T
0
XFP Cage with 45 Fin Heat Sink
U79-A1G1-2001
20