SFP 2xN
Amphenol’s SFP interconnect system consists of a 20-position connector enclosed in a metal cage
mounted to a host PCB.
Amphenol’s stacked SFP combos are rated up to 6 Gbps. The connector accepts multiple transceivers
per INF-8074i and combines, transmits, and receives functions in a low cost, compact, and ꢀexible
format. The cages have a two-piece construction with enhanced transceiver mating tabs available in a
press-ꢁt version or a solder tail version. Longer and shorter pins are available as custom options. Stacked
versions (2xN) consist of a 2-row cage with integrated 2-row connectors.
UE78-L1126-00321
UE78-B2127-00321
UE78-B8126-00321
Materials
Speciꢀcation Highlights
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Cage
Base Material: Copper Alloy
The interconnect system is comprised of a cage
assembly which is used with 20-position SFP
connectors complying with MSA Agreement INF-8074i.
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Plating: Nickel or Tin
Light Pipe: Optical Grade Polycarbonate
Heat Sink: Aluminum Alloy
Heat Sink Clip: Stainless Steel
Dust Cover: Thermoplastic
General Characteristics
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RoHS Compliant
Industry Standard Footprint
Industry Standard EIA-364
EMI Ground Tabs: Stainless Steel
Connector
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Contact Base Material: Copper Alloy
Contact Plating: Gold on Mating Area, Gold
or Matte Tin on Termination
Housings: Glass Reinforced, Lead-Free Solder
Reflow Process Compatible Thermoplastic,
UL94V-0 Rated
Mechanical Characteristics
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Accepts Multiple Transceivers per INF-8074i
Compliant Press-Fit Pins or Solder Tails (1x1
Cages)
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Durability: 250 Mating Cycles min
Temperature Rating
Electrical Characteristics
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Operating Temperature: -55°C to +85°C
Storage Temperature: -55°C to +105°C
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Hot Swappable
Operating Voltage: 3.3 V
Operating Current: 0.5 A
Differential Impedance: 100 Ω +/- 10 Ω
DWV: 300 V AC
Insulation Resistance: 1000 MΩ min
Contact Resistance: 70 mΩ max
Spring Fingers for Superior EMI Grounding
Conꢀgurations (Rows x Ports per Row)
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2x1
2x4
2x6
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2x2
2x5
2x8
Options
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Dust Cover
Light Pipe
Heat Sink (Standard Fin for Final Cage Combo)
Enhanced EMI Performance Cage
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